Samsung announced its breakthrough in the development of 8GB LPDDR4 RAM for mobile phones and tablet few months back but it looks like Samsung isn’t going to have a monopoly of that RAM size. South Korean company SK Hynix has equally announced that it has manufactured a new generation of 8GB LPDDR4 memory in a single chip package suitable for smart phones, tablets and PCs.

The SK Hynix 8GB (64GB) LPDDR4 memory incorporates four 2GB (16GB) DRAM ICs with a nominal data transfer rate or frequency of 3733MT/s (that is 3733MHz). This is lower than the 4266MHz frequency the Samsung 8GB LPDDR4 memory is said to have. The Hynix memory chip also comes with a bandwidth of 29.8GB/s.

Unlike Samsung’s own 8GB LPDDR4 memory which uses the 10nm manufacturing process, the Hynix chip uses a 21nm manufacturing process but is compatible with mainstream mobile phones. It also supports UFS NAND flash memory, voltage rating of 1.8 / 1.1V. This version is now shipping. There is another version with a broader 0.6V ultra low-grade voltage rating which is more energy efficient but this version would ship in the first quarter (Q1) of 2017. This version has as its product number – H9HKNNNFBMMUDR-NMH.

About SK Hynix

In case you don’t know, SK Hynix is the world’s second largest chipmaker after Samsung and the World’s fifth-largest semiconductor company. The company is also known as Hyundai Electronics and in fact, Hynix is an abbreviated form of Hyundai Electronics. A merger with fellow Korean company, SK group gave rise to the name SK Hynix.

Read More: Samsung Announces Industry’s First 8GB LPDDR4 DRAM For Mobile & Tablets

The company supplies memory semiconductors of dynamic random access memory (DRAM) and flash memory chips. Its clientèle cuts across from Apple, Asus, IBM, Dell, right to Hewlett-Packard. Hynix memory is used by Apple in some of their iMac, MacBook and MacBook Pro computers. Hynix memory is also used by Asus in their Google-branded Nexus 7 tablet, an OEM provider for IBM System x servers, and is used in PC desktops as well as the ASUS Eee PC. Dell and Hewlett-Packard have also used Hynix memory as OEM equipment. Other products that use Hynix memory include DVD players, cellular phones, set-top boxes, personal digital assistants, networking equipment, and hard disk drives.

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Samsung has today officially announced the introduction of what is said to be the industry’s first 8GB LPDDR4 (low power, double data rate 4) DRAM package for mobile devices. According to the report, the 8GB mobile DRAM package uses four of its latest 16GB LPDDR4 memory chips and is manufactured using advanced 10nm-class process technology.

The 8GB LPDDR4 DRAM comes in as a powerful mobile DRAM solution which the company says will enable more capable next-generation, flagship mobile devices around the world and is suited to meet the escalating needs of devices having dual camera, 4K UHD and VR features.

Continuing, the company disclosed the new 8GB LPDDR4 operates at up to 4,266 megabits per second (Mbps), which is twice as fast as DDR4 DRAM for PCs working typically at 2,133 Mbps per pin. Assuming a 64 bit (x64) wide memory bus, this can be viewed as transmitting over 34GBs of data per second. Already, there are a number of high-end ultra-slim note PCs using 8GB of DRAM currently but Samsung’s new 8GB LPDDR4 package will help other next-generation mobile devices take full advantage of its extremely high capacity. For example, equipping tablets with 8GB of LPDDR4 will enable virtual machine operation and smoother 4K UHD video playback, popular features of many premium PCs.

In addition, the Samsung 8GB LPDDR4 DRAM provides much more efficient power consumption thanks to its use of the latest 10nm-class process technology and Samsung’s proprietary low-power circuit design. This circuit design enables the memory chip to double the capacity of the company’s 20nm-class 4GB DRAM package, while consuming approximately the same amount of power.

In terms of dimension, the 8GB LPDDR4 package comes in under 15mm x 15mm x 1.0mm, which satisfies space requirements of most new, ultra slim mobile devices. Using a DRAM package thinner than 1.0mm enables stacking the package together with UFS memory or a mobile application processor, depending on device manufacturers’ preferences, which will allow further space savings on the printed circuit board.

Read More: Samsung Rumored as working on Snapdragon 830 Chip on a 10nm Process

In August last year, Samsung introduced the industry-first 20-nanometer 12GB LPDDR4 DRAM and now after only 14 months in development, the Korean tech giant is introducing the first 10nm-class single-package solution of 8GB LPDDR4 DRAM which is expected to speed up the launch of next-generation mobile devices and tablets with even more advanced performance.

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