MediaTek is expected to announce a lower variant of its newly unveiled Dimensity 9000 SoC. This upcoming chipset is said to go official as Dimensity 7000. Ahead of that, the General Manager of the Redmi brand teases this silicon.

A couple of days back, Redmi GM Lu Weibing teased the yet-to-be-announced Dimensity 7000 chip on Weibo by questioning what kind of processor it is. This clearly suggests that there will be Redmi smartphones powered by this SoC as the executive is known for vague teasers.

Although the Xiaomi group exec doesn’t hint at the device, we can speculate it to be the recently spotted Xiaomi Rubens (L11A), which is expected to house the unreleased MediaTek silicon. Currently, there’s only a Chinese variant of this phone with model number 22041211AC.

As of now, we only know that the handset will feature a triple camera array on the rear. This setup will include a 64MP Samsung ISOCELL GW3 primary sensor.

As far as the marketing name is concerned, it is rumored to go official as Redmi K50 Gaming Standard Edition. While the Xiaomi Matisse (L10) with a MediaTek Dimensity 9000 is said to release as Redmi K50 Gaming Pro.

We look forward to learning more about Xiaomi Rubens before its launch via certifications, leaks, and teasers in the coming days.

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A few days ago, MediaTek announced its latest flagship smartphone chipset — Dimensity 9000 which is manufactured using TSMC’s 4nm process and is set to compete against the upcoming Snapdragon 8 Gen 1 (aka Snapdragon 898).

However, there are reports about the Taiwan-based company working on an upper mid-range chipset — Dimensity 7000. Ahead of the official launch, some details of this new processor from MediaTek have leaked online.

As per the report from tipster Digital Chat Station, the MediaTek Dimensity 7000 supports 75W charging, placing the chipset between the Snapdragon 870 and Snapdragon 888 from its rival Qualcomm. It is expected to be based on ARM’s new V9 architecture which is also used in the Dimensity 9000 SoC.

The MediaTek Dimensity 7000 will be manufactured using TSMC’s 5nm process. This places the processor between Dimensity 1200 which is manufactured using a 6nm process and the newly announced Dimensity 9000 which is based on a 4nm process.

It is being claimed that the chipset has already entered the testing phase and if that’s true, then the official announcement of Dimensity 7000 should happen soon. But before that, we expect to get more details about this new chip through leaks as there’s still a lot of information about this upcoming processor that remains unknown.

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Today, MediaTek announced their latest flagship SoC, the Dimensity 9000, making it the first SoC based on TSMC‘s 4nm process. The SoC is set to compete against the upcoming Qualcomm Snapdragon 8 Gen1 (Snapdragon 898). It looked like MediaTek will skip the 5nm process altogether, but that might not be the case.

A few hours after the announcement of the 4nm SoC, the reliable tipster Digital Chat Station posted on Weibo (a Chinese microblogging website) that MediaTek’s 5nm SoC, which is apparently going through the testing phase, might be called the MediaTek Dimensity 7000. If we go by the earlier launch of Dimensity 9000, we can expect the SoC to be based on ARM’s new v9 architecture. The Dimensity 7000 may replace the current 6nm lineup offered by MediaTek, like the Dimensity 1200, and compete with Qualcomm’s 5nm offering, the Snapdragon 888.

If the rumor turns out to be accurate, with the announcement of their 4nm flagship SoC, the Dimensity 9000, MediaTek might be gearing up to compete against Qualcomm in every market segment. The Dimensity 7000 might be a premium mid-range offering by MediaTek that may force Qualcomm to offer a competative 5nm solution in the premium mid-range as well. All in all, the rumor makes us excited for the future of the mid-range smartphone market. However, these are still rumors and educated guesses, so we advise you to take it with a pinch of salt.

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The post MediaTek testing the 5nm based Dimensity 7000: Tipster appeared first on Gizmochina.