MediaTek is expected to announce a lower variant of its newly unveiled Dimensity 9000 SoC. This upcoming chipset is said to go official as Dimensity 7000. Ahead of that, the General Manager of the Redmi brand teases this silicon.
A couple of days back, Redmi GM Lu Weibing teased the yet-to-be-announced Dimensity 7000 chip on Weibo by questioning what kind of processor it is. This clearly suggests that there will be Redmi smartphones powered by this SoC as the executive is known for vague teasers.
Although the Xiaomi group exec doesn’t hint at the device, we can speculate it to be the recently spotted Xiaomi Rubens (L11A), which is expected to house the unreleased MediaTek silicon. Currently, there’s only a Chinese variant of this phone with model number 22041211AC.
As of now, we only know that the handset will feature a triple camera array on the rear. This setup will include a 64MP Samsung ISOCELL GW3 primary sensor.
As far as the marketing name is concerned, it is rumored to go official as Redmi K50 Gaming Standard Edition. While the Xiaomi Matisse (L10) with a MediaTek Dimensity 9000 is said to release as Redmi K50 Gaming Pro.
We look forward to learning more about Xiaomi Rubens before its launch via certifications, leaks, and teasers in the coming days.
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