A few days ago, MediaTek announced its latest flagship smartphone chipset — Dimensity 9000 which is manufactured using TSMC’s 4nm process and is set to compete against the upcoming Snapdragon 8 Gen 1 (aka Snapdragon 898).
However, there are reports about the Taiwan-based company working on an upper mid-range chipset — Dimensity 7000. Ahead of the official launch, some details of this new processor from MediaTek have leaked online.
As per the report from tipster Digital Chat Station, the MediaTek Dimensity 7000 supports 75W charging, placing the chipset between the Snapdragon 870 and Snapdragon 888 from its rival Qualcomm. It is expected to be based on ARM’s new V9 architecture which is also used in the Dimensity 9000 SoC.
The MediaTek Dimensity 7000 will be manufactured using TSMC’s 5nm process. This places the processor between Dimensity 1200 which is manufactured using a 6nm process and the newly announced Dimensity 9000 which is based on a 4nm process.
It is being claimed that the chipset has already entered the testing phase and if that’s true, then the official announcement of Dimensity 7000 should happen soon. But before that, we expect to get more details about this new chip through leaks as there’s still a lot of information about this upcoming processor that remains unknown.
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