MediaTek today released two new mid-range chipsets – the Dimensity 7300 and Dimensity 7300X. Both of the chips are fabricated on a 4nm process node and are said to offer 25% lower power consumption on the performance cores when compared with Dimensity 7050.

Unlike the Dimensity 7050‘s (2+6) core cluster, the Dimensity 7300 series offers 4 x Cortex-A78 cores clocked at 2.5GHz paired with 4 x Cortex-A55 cores clocked at 2.0GHz. Notably, these are the same cores that are used by the Dimensity 7050. However, there are some performance and power efficiency improvements.

For graphics, the Dimensity 7300 series equips the latest Arm Mali-G615 GPU along with a suite of MediaTek HyperEngine optimizations, that aim to improve the gaming experience. According to MediaTek, both of the chips offer an improved gaming experience with a 20% higher FPS along with 20% less power consumption in comparison to its competitors. The series also comes with “smart resource optimization”, network optimization for games, and support for Bluetooth LE (Low Energy) with Dual-Link True Wireless Stereo Audio.

A difference between the two chips is that the latter one supports dual displays, which means it could also be used in a more affordable foldable device.

Imaging improvements

The Dimensity 7300 series also brings imaging improvements to the table with the new MediaTek Imagiq 950, which features a premium-grade 12-bit HDR-ISP. Mid-range phones with this series will support a 200MP main camera. With enhanced hardware engines, it also provides precise noise reduction (MCNR), face detection (HWFD), and video HDR. Live focus photo performance and photo remastering is now 1.3X and 1.5X faster respectively as compared to the Dimensity 7050.

In simple words, the chip will allow OEMs to provide a better camera system, however, it depends on the smartphone makers how they are going to take advantage of the added capabilities.

The series boasts the MediaTek APU 655 which offers 2x improvement in AI performance as compared to the Dimensity 7050.

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