MediaTek has quietly introduced its latest processor, the Dimensity 7050. The new chipset is set to make its debut in the upcoming Realme 11 series of smartphones, with the Realme 11 Pro+ model recently spotted on Geekbench sporting the Dimensity 7050 and 12GB of RAM.
MediaTek is actually rebranding its existing Dimensity 700, 800, and 900 series SoCs under the fresh Dimensity 6000 and specific 7000 series. The move is intended to simplify the company’s product portfolio and deliver a more transparent naming system for consumers. The core technology and specifications largely remain the same. MediaTek Dimensity 7050 is the rebranded version of the Dimensity 1080.
MediaTek Dimensity 7050 specifications:
The Dimensity 7050 SoC has been manufactured using TSMC’s advanced 6nm process technology, and its CPU is composed of two high-performance 2.6GHz Cortex-A78 cores and six power-efficient 2.0GHz Cortex-A55 cores. The GPU features a Mali-G68 MC4, with support for LPDDR5/4x memory and UFS 3.1/2.1 storage standards.
When it comes to display capabilities, the chipset can handle screens with resolutions of up to 2520 x 1080 pixels and 120Hz refresh rates. Camera support is also impressive, with the ability to accommodate lenses of up to 200MP, 4K HDR video recording, and advanced features like hardware HDR video, triple HDR-ISP, and MENR.
On the video front, the Dimensity 7050 offers encoding support for HEVC and H.264 formats, as well as playback compatibility with HEVC, H.264, MPEG-1/2/4, and VP-9 codecs.
Devices powered by the Dimensity 7050 chipset are expected to provide a substantial boost to gaming performance. MediaTek has integrated features such as Wi-Fi Rapid Channel, a 5G HSR mode tailored for gaming, and a super hotspot energy-saving technology to ensure a seamless gaming experience for users.
Additionally, the processor comes with support for global navigation satellite systems (GNSS) and the latest Wi-Fi 6 standard, further expanding its capabilities and compatibility.
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