If the reports are to be believed, then the South Korean giant Samsung is gearing up to launch its next-generation S-series flagship smartphones, the Galaxy S21 lineup, in January 2020, weeks earlier than the usual timeline.

Now, with a few days left for the smartphone to go official, the Samsung Galaxy S21 powered by the Qualcomm Snapdragon 875 chipset has appeared on the benchmarking platform Geekbench.

As per the listing on the benchmarking platform, it managed to score 3,319 points in the multi-core test. Surprisingly, the score is quite low when compared to the same smartphone powered by Samsung’s own Exynos 2100 chipset, which managed to score almost 4,000 points on Geekbench.

Samsung has been launching two variants of its Galaxy S-series flagship smartphone based on the chipset used. The Qualcomm-powered models are made available in the United States, South Korea, and China while the rest of the world gets Exynos-powered variants.

Most users have been complaining about getting the Exynos variant in their region as the Qualcomm-powered model offers better power management. However, it seems that the tables have turned this time if the benchmark scores are to be believed.

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It’s interesting to see Samsung Exynos 2100 outperforming the Qualcomm Snapdragon 875 chipset. Both of them are said to have the same CPU architecture with X1 Core which will reach 2.91GHz in Exynos 2100 while in SD875, it will reach 2.84GHz.

Reports indicate that the three Cortex-A78 cores will be clocked at 2.81GHz on Samsung’s chipset while they will be running at 2.42GHz on the Qualcomm processor. Also, the four Cortex-A55 cores in SD875 will be at 1.8GHz while the Exynos 2100 will have them running at about 2.21GHz. Thus, Samsung’s chipset is performing better in the multi-core tests.

Do note that these are just the benchmark results leaked online and it remains to be seen how the device performs with real-world usage. The wait for the official launch of the Samsung Galaxy S21 series phones isn’t long as they are expected to go official in the second week of January 2021.

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Qualcomm Tech Summit is scheduled to start from 1st December and the company will be announcing its next-generation flagship smartphone chipset — Qualcomm Snapdragon 875. Now, just weeks before the official announcement, details about the upcoming SoC have been leaked online.

A new report coming from China claims that the Snapdragon 875 will be manufactured using a 5nm node. It’s noteworthy that this is not new information as it had already been revealed earlier. Also, it won’t be the first chipset to be made using the 5nm process as Apple A14 Bionic and Huawei HiSilicon Kirin 9000 have already been launched.

The report reveals that the upcoming octa-core chipset will come with one oversized core clocked at 2.84GHz, three Cortex-A78 cores clocked at 2.42GHz, and four Cortex-A55 cores which are clocked at 1.8GHz. It is also said to pack Adreno 660 GPU for enhanced graphics performance.

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Previously, it was reported that for the SD875 chipset, Qualcomm is opting for an “oversized” core which is Cortex-X1 that is claimed to offer 23 percent improvements in terms of performance than the Cortex-A78.

As for the connectivity support, the SoC is expected to come with Snapdragon X60 5G modem but it remains to be seen if the company opts to make it an integrated modem, similar to what it did with its predecessor.

Just a couple of days ago, a prototype device powered by the Qualcomm SD875 SoC was spotted on the AnTuTu benchmarking platform, revealing that the chipset scored 899,401 points with a CPU score of 333,246 points and a GPU score of 342,225 points.

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Noted Chinese tipster Digital Chat Station has shared yet another benchmark result purportedly for a prototype smartphone powered by Qualcomm‘s next-generation Snapdragon 875 chipset. The screenshot shared reaffirms the chipset will bear the codename Lahaina, a scenic spot on the west coast of Hawaii. Qualcomm had previously announced that it will hold a Snapdragon chip conference in Hawaii in December.

The benchmark screenshot(via) equally shows the detailed score of the prototype device. The Snapdragon 875 is on the driving seat and the device scores 899,401 points which is higher than the first AnTuTu score of the device which is 847,868 points. The device records a CPU score of 333,246 points and a GPU score of 342,225 points.

For the memory test, the device recorded a total score of 98,772 points while the storage test sees the Snapdragon 875-powered device record a score of 125,135 points.

Since this is a prototype, the performance for the final product may be slightly lower but comparatively, the performance floors those of other chipsets including the Snapdragon 865 and Kirin 9000.

Previous rumours tipped the Mi 11 to be the first smartphone to utilise the Qualcomm Snapdragon 875 flagship chip in China. The Galaxy S21 series may likely be the first to launch with a Snapdragon 875-powered device. The chip is expected to be manufactured on a 5nm process and is said to adopt a “1+3+4” octa-core design. The “1” is the super-large core Cortex X1 with its peak performance 23% higher than that of the Cortex A78.

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Apple has unveiled its latest A14 chipset which is powering the newly launched iPad Air. The same 5nm chipset will be powering the upcoming 5G-ready iPhone 12 models that are set to launch in the coming weeks.

Soon after this, Redmi teased that the company will soon be launching its flagship smartphone powered by a 5nm chipset. Now, Realme executive has also teased a new flagship smartphone to be powered by Snapdragon 875 chipset.

Xu Qi, President of Global Marketing and Vice President at Realme, has shared a teaser poster on Weibo which hits at a new flagship smartphone from the company powered by a 5nm flagship chipset.

Given that most of the Android flagship smartphones are powered by Qualcomm chipset, it’s safe to assume that the phones teased by Redmi and Realme will pack the upcoming Qualcomm Snapdragon 875 SoC.

The development comes at a time when there are reports claiming that OPPO has killed off its Ace lineup of smartphones and will be replacing it with a new series under its Realme brand with flagship-grade specifications.

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If Qualcomm is sticking to its usual schedule, then the Snapdragon 875 flagship chipset could be unveiled by the end of this year and we will start getting smartphones powered by the same some time in Q1 2021.

As per the reports, the Snapdragon 875 SoC could come with Cortex-X1 Super Core and Cortex-A78 Core. The X1 Core is 30 percent more energy-efficient than the A77 core and 23 percent more when compared to A78 core.

Apart from Qualcomm, Samsung and Huawei are also working on their next-generation flagship chipset based on the 5nm process. The Huawei’s Kirin 9000 will be powering the Mate 40 series devices and should get launched in the coming weeks.

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Qualcomm Snapdragon 865 chipset is currently the flagship offering from the company which is powering most of the premium smartphones launched this year so far and will continue to do so until its successor arrives.

The successor to the SD865 SoC is expected to get launched as Qualcomm Snapdragon 875 by the end of this year, most probably in December. As per the reports, the chipset could be the company’s first to be manufactured using 5nm process.

Now, a new report claims that the upcoming Snapdragon 875 chipset, codenamed SM8350, will come packed with the new Snapdragon X60 5G modem RF-integrated system. It remains to be seen if the modem will be integrated or optional. Given that the 5G adaptation is on the rise, it won’t be surprising if Qualcomm decides to go with the integrated modem route.

The Qualcomm Snapdragon 865 also comes with an embedded 5G modem but people are not happy with this given that it has increased the cost of the chipset. This has led to smartphones being more expensive even for the 4G-only models as 5G infrastructure is still at the early stage of development.

The report adds that the upcoming SD875 will have Kryo 685 CPU built on ARM v8 Cortex technology with Adreno 660 GPU, Adreno 65 VPU, and Adreno 1095 DPU. The modem will support mmWave and sub-6GHz bands.

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It is also said to have Qualcomm Secure Processing Unit (SPU250), Spectra 580 image-processing engine, and Snapdragon Sensors Core Technology. As for the connectivity options, it’ll have external Wi-Fi 802.11ax, 2×2 MIMO, and Bluetooth Milan.

The chipset will come with Compute Hexagon DSP with Hexagon Vector eXtensions and Hexagon Tensor Accelerator. It will support Quad-channel package-on-package (PoP) high-speed LPDDR5 SDRAM. It is also said to come with low-power audio subsystem combined with Aqstic Audio Technologies WCD9380 and WCD9385 audio codec.

Meanwhile, we are waiting for some kind of confirmation about the Snapdragon 865+ chipset. Some some reports says that the upgraded SoC is coming and the specs have also leaked, Meizu CMO recently said that SD865+ isn’t coming this year.

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