The realme GT NEO 3 is all set for a launch tomorrow in China, and ahead of that, a new leak has given us a glimpse into its gaming performance. The MediaTek Dimensity 8100 under the hood is undoubtedly one of the most powerful mobile chips currently, but its capabilities are further enhanced with the frame insertion tech onboard the device.

As clear from the video demo below (via WHYLAB), the frame insertion tech does wonders with Genshin Impact, nearly doubling its framerate. The game is among the most demanding mobile titles, but with frame insertion turned on, the realme GT NEO 3 handles it without breaking a sweat.

It isn’t clear if the tech will work universally, across all games, or if it will only support select titles, but we should know soon enough.

The Dimensity 8100 in the realme GT NEO 3 has outperformed the Snapdragon 8 Gen 1 in some tests and has been declared a high-end chip rather than a flagship one. It is touted as being more power-efficient than Qualcomm’s flagship as well as the Dimensity 9000, too.

A high-end chip means the device is high-end too, and features near-flagship-level specifications. As such, its display is a 6.7-inch AMOLED display with an FHD+ resolution and a 120Hz refresh rate. The back features a triple camera setup with a 50MP main cam alongside 8MP ultrawide and 2MP auxiliary modules. The device even supports 150W charging, which is the fastest in the industry.

RELATED:

• Realme GT Neo 3 features flagship Sony IMX766 sensor with OIS -Exec confirms
• Realme GT Neo3’s display costs more than GT Neo2; has 94.2% screen-to-body ratio
• realme GT NEO 3 front design revealed: slim bezels, center-aligned punch-hole
• Realme GT Neo3 teaser confirms Dimensity 8100 processor and independent display chip
• Realme GT Neo3 will go from 0% to 50% in just 5 minutes

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