Qualcomm has been working on its next-generation flagship chipset — Snapdragon 875, which is based on the 5nm process. It is expected to get launched by the end of this year and we could get devices powered by the same soon after the launch.

The upcoming flagship chipset is codenamed SM8350 and is internally known as Lahaina. Tipster Roland Quandt claims that there will also be Snapdragon 865 Plus variant, similar to what we have seen with the SD855 and SD865 chipsets.

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Now, as per the report, apart from the SD875 SoC with 5nm node, we will see Qualcomm launching its first 6nm processor — Qualcomm Snapdragon 775G. Going by the name, it will be a successor to the SD765G which powers the OnePlus Nord and LG Velvet.

It is reportedly based on a 6nm architecture and is expected to have a 40 percent faster CPU and 50 percent better graphics than the Snapdragon 765G. It is also said to support 120Hz display, 12GB LPDDR5 RAM, and 256GB UFS 3.1 storage.

As for the flagship Snapdragon 875 chipset, it is manufactured using Samsung’s 5nm EUV process as TSMC’s 5nm capacity has been reserved by Apple for its A14 Bionic chipset. The chipset is expected to be 25 percent smaller and 20 percent more power-efficient compared to the current-generation 7nm SoCs.

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Samsung has been hard at work to catch up to the world’s largest contract chipmaker, TSMC. The South Korean tech giant has taken numerous steps to boost production, but it seems like the company is still struggling to improve yields of 5nm chips.

At the moment, TSMC (Taiwan Semiconductor Manufacturing Company) is mass producing 5nm chips for various companies, including Apple with its A14 chips. On the other hand, Samsung Foundry is reportedly facing issues in a similar department with low yields of its 5nm EUV (Extreme Ultraviolet) process. The company had first announced this processes’ development back in 2019, but due to the Coronavirus pandemic, it seems the company is still struggling to boost yields.

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According to a report from DigiTimes, the company had recently acquired orders from Qualcomm for the mass production of its upcoming flagship Snapdragon 875G and Snapdragon 735G chips. However, the recent difficulties being faced by the company might end up affecting the launch of the upcoming Qualcomm chips which will be found in smartphones in 2021.

Notably, Samsung had previously announced that it would be starting mass production of 5nm chips by the end of Q2 2020. Although, it is still unknown if the company managed to begin mass production as of yet. While several rumors and reports had pointed at the Galaxy Note 20 series featuring the first 5nm chips (Exynos 992), the recent news might be behind its supposed cancellation.

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Qualcomm recently unveiled its latest flagship chipset — Snapdragon 865 Plus, which as the name indicates, is an upgraded variant of the Snapdragon 865 SoC that was launched by the company last year.

Now, the company is gearing up to launch its next-generation flagship chipset, which is likely to be named Snapdragon 875. While the company is yet to officially acknowledge this, the leaked future chips roadmap has revealed some information.

A Weibo user has shared an image showcasing Qualcomm‘s product planning for the upcoming chipsets. It reveals that the Snapdragon 662 and Snapdragon 460 SoC will be launched in this fourth quarter of this year.

Further, the Snapdragon 875G and Snapdragon 435G will be unveiled in Q1 2021. Apart from these, the Snapdragon 735G is expected to get launched in Q1 or Q2 next year.

Interestingly, the standard Qualcomm Snapdragon 875 SoC is missing from the list. If the company plans to launch it, we expect it to get announced in December this year, similar to the previous flagship chipset launch from the company.

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The leak reveals that the SD875G and SD735G are the flagship and mid-range chipsets from Qualcomm, set to launch in 2021. Both of them are manufactured using Samsung’s 5nm EUV process which increases performance by 10 percent and reduces power consumption by 20 percent.

Qualcomm is expected to use the combination of Cortex X1 Super Core + Cortex A78 Large Core for the upcoming Snapdragon 875G chipset. With such architecture, the chipset could break the performance records when it comes to chipsets powering Android smartphones.

The leak also reveals that Qualcomm’s rival MediaTek is set to launch Dimensity 600 chipset in the third quarter of this year, i.e. in Q3 2020. It has been reported that the Taiwan-based company has received a large number of orders for the upcoming chipset.

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