The Xiaomi 13 Ultra was just recently announced and arrived as the company’s true flagship model that pushes the boundaries of mobile camera photography. Now, soon after its unveiling, a new teardown video has offered us a close look at the internal workings of this device and it is impressive. So let’s have a look.

Xiaomi 13 Ultra teardown highlights the variable aperture camera tech

Xiaomi 13 Ultra sits as the top end model from the Chinese tech giant which features various cutting edge technology. It not only features the world’s brightest smartphone display ever, but also features a variable aperture module that is housed on its 50 megapixel quad camera setup on the rear. Talking about the device itself, the 13 Ultra model sports a 6.73 inch AMOLED display that features Dolby Vision certification, 2K resolution, 120Hz refresh rate, and 1,300 nits of peak brightness. The Snapdragon 8 Gen 2 SoC is paired with 16GB of RAM and 1TB storage. The rear houses a 50 megapixel Sony IMX989 1 inch type primary sensor that has an f/1.9-4.0 variable aperture.

Looking at the teardown video, we can clearly see the RAM and UFS storage module in the teardown video. Furthermore, we can even see Qualcomm’s latest and greatest Snapdragon 8 Gen 2 SoC that powers the 13 Ultra model. Apart from this chipset, we can even see the brand’s custom Xiaomi P2 chip that handles the device’s power supply.

The hefty cooling mechanism can also be seen with copper alloy materials being situated right below the display. Interestingly enough, the camera module also arrives with plenty of thermal paste around the module to ensure optimum functioning without overheating. The variable aperture that is housed with the primary camera sensor (which is a 50 megapixel shooter) can also be seen.

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Xiaomi launched the Redmi Note 10 series in India and other Global markets on March 4. The sales of the devices are expected to begin Globally in a couple of days and from March 16 in India. Ahead of this, Xiaomi has released an official teardown of the Redmi Note 10 Pro/ Redmi Note 10 Pro Max.

In the YouTube video, released by Xiaomi officially, the device being torn down is the Gradient Bronze variant of the Global Redmi Note 10 Pro. We already know that the device is the almost same as the Redmi Note 10 Pro Max in India.

The video begins with removing the back panel cover and showing the rear of the device. Here, we see three parts already- The top portion with processor, storage, camera, one of the dual speakers, battery at the center, and the bottom part.

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First, the top inside portion of the rear panel that has the camera and CPU cover, along with the side frame is removed. This also has the connection to the Arc side-fingerprint sensor. As we all know, the LED Flash is beside the camera setup and here, it looks like Xiaomi has soldered it onto the motherboard.

Moving on, we see the huge 108MP Samsung HM2 sensor along with ultra-wide, Telemacro, and depth sensor. Do note that all of them are placed separately and not as a single module. The top portion also has IR blaster, 3.5mm audio jack.

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At the center resides the single 16MP selfie camera which is revealed by turning the top portion of the arrangement. Speaking of which, the inverted top portion shows the CPU, LPDDR4x RAM, covered in metal plate, and SIM card tray.

Also, one of the Stereo speakers/receiving unit is actually fixed to the mid-frame and not the top portion we saw above. After, this, decoupling the battery from the center position shows us the manufacturer in detail. The rated 4,920mAh/Typical 5,020mAh Li-ion Polymer battery is made by China’s Sunwoda Electronics Co Ltd.,

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Last but not the least, we see the display and the bottom portion. Here, the bottom port has the other speaker, Type-C port, Z-Axis linear vibration motor, and is connected via a long ribbon cable to the motherboard.

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Xiaomi, the Chinese smartphone manufacturer, has just released the official teardown video of its latest flagship, the Mi 10 Pro. The video offers a look inside the internal structure of the smartphone and also provides a brief explanation with texts and images.

Starting from the rear, Xiaomi reveals the internals of the device by removing the back panel of the device. After removing the glue that binds the rear cover to the body, two large foam rubbers can be observed at the top and bottom of the device. These primarily serve the purpose of protection from fall damage and accidents. Furthermore, a large portion of the internals is also covered with thermally conductive graphite which is found in the region that has the motherboard. Other components like NFC coils and wireless charging technology can also be seen.

The speakers of the Xiaomi Mi 10 Pro are housed symmetrically on the top and bottom of the device. It features a magnetic steel design and arrives with a 1.22cc large cavity, which enables a better stereo audio experience. Notably, the Mi 10 Pro’s speakers are said to have improved on the volume levels over its previous generations by 100 percent.

After removing the motherboard cover, the actual board and the Mi 10 Pro’s battery pack is made visible. The main board area uses a double layer motherboard design, meaning a smaller board being stacked upon the primary board to save space, and is found on the left side. On the right, the large 4,500mAh battery pack can be found and is housed on a middle frame, which also takes up most of the internal space. Under the battery pack, an ultra thin optical fingerprint scanner is situated, which is used for the in display fingerprint reading whilst saving previous internal space.

Once the rear camera cover is removed, one can also see the entire quad camera module of the Xiaomi Mi 10 Pro. As seen in the images, its 108 megapixel camera is the largest sensor and is conveniently placed in the middle. Other components, like LED flash and a laser focusing module, are also present that allows for better visibility and focusing speed in low light environments. On the other hand, the Mi 10 Pro sports a 20 megapixel selfie shooter on the front.

With the Mi 10 Pro, Xiaomi has adopted a unique 360 degree front and rear dual light sensor technology. In other words, the handset is better equipped in detecting light sources and the ambient lighting in its surroundings. This enables a better camera performance whilst also making the automatic screen brightness adjustment more intelligent and proactive.

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The motherboard of the flagship smartphone uses an “L” shaped design with copper foils and the graphite shield. Its upper regions contain the newly developed Wi-Fi 6 chip while the middle holds the power management module and audio decoding technology. The bottom of the motherboard houses a radio frequency chip.  Additionally, this portion also features a few of the highlighting components of the Mi 10 Pro. Qualcomm’s Snapdragon 865 SoC alongside the X55 5G modem is housed here. The pair of LPDDR5 flash memory and UFS 3.0 storage also enables class leading read and write speeds as well as fast data transfer capabilities.

With the Mi 10 Pro, Xiaomi has completely revamped its internal layout that manages to include an X axis linear vibration motor in the compact space while still catering for heat dissipation. To protect from heat related damages, the handset has built in VC soaking plate, 6 layers of graphite structure, large amounts of copper foil and thermally conductive gel as well. This VC protection layer extends across the power management chip and the 5G modem, covering an area of 3,000 square millimeters.

For added protection, it had a built in matrix temperature sensor and other temperate sensors spread across the device as well. This allows the Mi 10 Pro to accurately map heat in different regions in real time, including the 5G modem, the processor, battery pack, charging interface and more. Through this, the AI temperature control module automatically finds a suitable temperature by controlling device’s power output and performance simultaneously. In other words, a technological marvel which one may never really notice.

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Xiaomi announced the new Redmi Note 3 handset at its November 24 event in Beijing, China. The company managed to impress us all with this new release, given that it offers much more at $140 than the Redmi Note 2 which was already offering great value for money.

Like always, once a phone hits the market, people are curious about its internal components. Note 3 was no exception as a Chinese website performed a teardown of the device to its little components, revealing whats exactly inside this new smartphone.

Xiaomi has done a great job designing the device. Despite the new additions inside, the phone measures almost the same as its previous generation Redmi Note 2. The Note 3 measures 152mm in height as compared to 150mm on the Redmi Note 2 model and the width is the same on both the devices. Even in the thickness department, the new model is just 0.4mm thicker but that’s totally acceptable thanks to its huge 4000mAh battery. In short, the company has manged to pack in much more stuff than it could previously.

The tear down also reveals some of the manufacturers of internal components like the fingerprint sensor is from FPC (1022), and camera from Samsung (S5K3M2 ISOCELL Sensor). These components are packed closer together than the Redmi Note 2 and hence, the company has applied thermal paste in some places to prevent overheating.

Overall, it looks like the company has done a good job with the design. Unfortunately, unlike the guys over at iFixit, these guys didn’t mention a repair-ability score. But you can check out the teardown from the pictures down below.

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