Today, we saw details about the Kirin 960 as well as the Snapdragon 830 chipsets. The same source also revealed some details about the upcoming Mediatek flagship chipset, namely the Helio X30. Today’s report comes via two different sources, one is a noted analyst, Pan Jiutang who also revealed details about the above two chips and another is a frequent leakster black_digital, who had previously revealed info about the X30 chip.
So, let’s see what Mediatek could have in store for us for 2016. According to the analyst, the Helio X30 chip will come with the same deca-core architecture as the X20 and X25 chips. It will be built on the 10nm manufacturing node from TSMC. But the cores will be slightly different. The chip will be a combination of the new ARM Artemis cores, Cortex A53 and Cortex A35 cores. However, the source didn’t reveal the exact number of each cores. For GPU, MediaTek Helio X30 could use PowerVR graphics which would be a good upgrade from the Mali chips. The chip would also support 8GB RAM modules revealed the source. Other possible specs include upgraded video and audio features. Finally, he revealed that the chip should score around 160,000 on the AnTuTu benchmark.
Adding to this information, Black Digital released more details on Weibo. He said that the Helio X30 should also come with quad channel LPDDR4 RAM with support for up to 8GB memory. Plus, the storage would be super fast as the chip would support UFS 2.1 standard.
Helio X20 and X25 chips were left out from the pack of Samsung, Qualcomm and even Huawei flagship chips because they supported UFS 2.0. On the other hand, MTK chips only supported eMMC storage standard, which was clearly a let down. Looks like MTK is going to fix this issue with the new generation Helio X30.
Like mentioned above, this is not the first time we are hearing about the Helio X30. Lots of details were leaked about a month ago, and you can check out the info from our previous coverage.
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