TP-Link is primarily known for networking devices, but the company has jumped in the crowded smartphone market as well. It has so far launched entry-level and mid-range smartphones, but has not yet launched a premium smartphone. That is about to change soon as the company seems all set to launch a phone with top notch specs.
An upcoming smartphone from TP-Link under its Neffos line-up has been leaked, revealing the phone’s features. We also have a leaked press renders of the phone, giving us a look at what to expect in terms of smartphone’s design.
The smartphone, which is yet unnamed, resembles Samsung’s Galaxy S8. It will feature a full-screen bezel-less display with an aspect ratio of 18:9. There are virtually no bezels on either sides and on top and bottom, there are very thin bezels. At back, it seems that the device has a curved glass panel.
Since there is no space for buttons or anything else on the front side due to thin bezels, the fingerprint sensor is placed at the back of the device, just below the dual camera setup. While one camera sensor is of 16-megapixel, the other one is of 20-megapixel telephoto lens and will offer 2X optical zoom.
Under the hood, the phone is expected to be powered by Qualcomm‘s Snapdragon 835 processor, along with 6GB of RAM. As of internal storage, it could come with upto 256GB of storage. More details about the phone, such as battery capacity, software, connectivity options are not yet known.
This upcoming Neffos smartphone from TP-Link suggests a drastic change in the company’s strategy as far as the smartphone business is concerned. It will be interesting to see how this device is received in the market, and if it will give incumbents a run for their money.
While the phone’s launch, pricing or availability details are not yet known, we are expecting TP-Link to launch the device before the end of this year.