During the ongoing Snapdragon Tech Summit, Qualcomm has officially unveiled the powerful Snapdragon 845 Mobile Platform that is expected to power most of the flagship phones in 2018. The Snapdragon 845 that has arrived as the successor of the Snapdragon 835 will be offering better performance, improved efficiency along with enhanced image and video processing. Some of other features of Snapdragon 845 include support for AI, VR and AR.
ES Jung who is Samsung Electronics’ President and General Manger of Foundry Business has confirmed that his firm will be manufacturing the Snapdragon 845 chipset. The Snapdragon 835 SoC was built with 10nm manufacturing process. The newly announced Snapdragon 845 is the second-generation 10nm chipset from the company. It is confirmed to feature Snapdragon X20 LTE modem that will be able to produce gigabit connectivity on supported networks.
Read More: Qualcomm Snapdragon 845 Details Leaked, Will Use 10nm Process
At the Tech Summit, Xiaomi CEO Lei Jun also confirmed that its next premium smartphone would be powered by Snapdragon 845 SoC. Besides Xiaomi’s 2018 flagship, the SD 845 is expected to power flagship phones from Samsung, Sony, HTC and LG. Previous reports have revealed that the Samsung Galaxy S9 and Galaxy S9+ would be first Snapdragon 845 driven smartphones to arrive in the market. The new SoC is also expected to power non-Android devices such as Windows 10 PCs.
The U.S. based chip maker did not reveal the exact configuration of the Snapdragon 845 Mobile Platform. It has confirmed to give out more details on it on Dec. 6.
At the first day of the Snapdragon Tech Summit, the company had also unveiled Snapdragon 835 powered 2-in-1 form factor that will be brought to the market through partnering companies like ASUS and HP. More information on Snapdragon 845 Mobile Platform is expected to surface in this week as the Tech Summit event will be ending on Friday.
