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Qualcomm Snapdragon 845 Details Leaked, Will Use 10nm Process

by Habeeb Onawole 2

Qualcomm’s next flagship chipset is he Snapdragon 845. Details of the Mobile Platform expected to be unveiled in December have leaked online.

Snapdragon 845

According to the source, even though major foundries have begun 7nm trials, the flagship chips for next year will be built using the 10nm process and that includes Qualcomm’s Snapdragon 845 mobile platform too. However, the SD845 will use LPE and not LPP like the Exynos 9810.

The Snapdragon 845 will remain an octa-core processor. Four of them will be the Cortex-A75 and the other four will be Cortex-A53 cores. The SD845’s GPU will be an Adreno 630.

The chipset will have support for up to 25MP dual front and dual rear cameras, have a X20 baseband, support for 802.11 ad Wi-Fi, and have a maximum download speed of 1.2Gbps.

READ MORE: Broadcom Reportedly Planning To Launch An Improved Bid For Qualcomm

The Snapdragon 845 will likely appear first in the Samsung Galaxy S9 and S9+ globally and in the Xiaomi Mi 7 in China.

(Source)

 

 

 

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  • soul18reaver

    because of DynamIQ, A75 can only be paired with processors that also support it. so it will be A55 not A53

    • Tomm

      Or, they will make faulty SoCs.

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