Chinese rugged smartphone manufacturer AGM has officially announced that it will hold a global product launch conference on August 29 in Shenzhen. The event which is scheduled to commence at 2 pm will herald the official unveiling of the company’s latest rugged flagship model dubbed AGM X3.
The AGM X3 flagship has featured in several teasers and promotional articles. The most spectacular aspect about the device is the Snapdragon 845 chipset it will pack. The model takes over the rein from similar models like the AGM X1 and X2. Thus, it is the third-gen model.
Although the design is yet to be fully revealed, the device should have little difference from the X2 and the looks will be that of a premium but a rugged smartphone with waterproof features. The entire specifications of the device had also appeared online previously. From the leaked specs, we know the AGM X3 will sport a 5.99-inch display with an 18:9 aspect ratio. AGM will offer two versions of the device: one equipped with 6 GB of RAM and 64 GB of storage, another outfitted with 8 GB of LPDDR4X and 128 GB of NAND flash.
On the camera end, the X3 will pack a dual rear camera featuring 24MP + 12MP sensors as well as a front camera featuring a 20MP sensor. As for security features, the smartphone will support a fingerprint reader and a facial recognition technology. Connectivity features on the phone will include the integrated X20 LTE modem in the SoC, 2×2 802.11ac Wi-Fi, Bluetooth 5.0, NFC, and USB Type-C. The rugged flagship will also come with an IP68 waterproof and dustproof rating.