Ahead of the launch of Xiaomi Mi 9 Pro 5G smartphone in the company’s home market on 24th September, the company has been teasing features of this upcoming device. In the latest teaser, Xiaomi has confirmed that the Mi 9 Pro 5G will be powered by the new Qualcomm Snapdragon 855 Plus chipset.
Further, the same teaser poster also reveals that the smartphone will come with a custom XL VC Liquid Cooling module with a heat dissipation area of 1,127mm2. It will have 5-layer graphite, high thermal conductivity copper foil, and a thermal gel to offer “three-dimensional cooling system” which will reduce the CPU core temperature by 10.2 °C.
Additionally, it has also been confirmed through a teaser poster that the phone will come with a custom-made “transverse linear motor” to elicit a stronger sense of vibration — a haptic feedback that has start-stop speed of 10ms, just like a mechanical keyboard. With this Vibration HD feature, the phone will offer an 4D immersive gaming experience.
Earlier, the company had revealed that the Mi 9 Pro 5G smartphone will have 40W wired fast charging, 30W wireless fast charging as well as 10W reverse charging support. The 30W Super Wireless Flash charing is claimed by the company to charge the 4,000mAh battery up to 50 percent in 25 minutes and takes around 69 minutes to fully charge. The 40W wired fast charging will bring the phone from 0% to 100% in a mere 48 minutes.
The Mi 9 Pro 5G has already been certified by TENAA, which reveals that the phone will come with a 6.39-inch display and should come with up to 12GB of RAM and 512GB of internal storage. We expect the smartphone to run MIUI 11 out-of-the-box.
Along with the Mi 9 Pro 5G, Xiaomi is also set to introduce its new Mi MIX 4 flagship smartphone which could feature a 100-megapixel camera sensor. The company will also be launching a new Mi TV model and its new MIUI 11 operating system with major updates.
