Honor 30s leaked multiple times over the last week and yesterday the brand even announced the launch date as March 30. Now, Honor’s president has confirmed that the handset will be first to feature the brand new HiSilicon Kirin 820 SoC.
He said that Kirin 820 with 5G connectivity will perform extremely well and it will debut on Honor 30s. This statement is more than enough for us to anticipate the new chip. Because the only widely used mid-range 5G chip is Qualcomm Snapdragon 765G, whereas MediaTek’s Dimentsity 1000 / L is only available on Oppo Reno 3 5G yet. With more mid-range 5G chips in the market, more people will get to use 5G networks in the regions where it is available.
The Huawei’s HiSilicon Kirin 820 5G chipset will likely be based on the company’s own Da Vinci architecture NPU built on the 7nm process. The silicon should use ARM Cortex-A76 CPU cores and G77 GPU. Further, the newer ISP and NPU present in it will have support for Kirin Gaming Plus technology.
As per previous leaks, the Honor 30s will feature a side-mounted fingerprint sensor, a quad-camera setup, 40W charging support, and will come in White and Orange gradient color options.
UP NEXT: Honor 30S launch date is March 30
