Foxconn Electronics is working on a new project which will have it build a new advanced semiconductor assembly and test plant in Qingdao, northeast China. The project will have the company invest 60 billion Yuan (roughly 8.6 billion US Dollars).
The known Apple supplier is building a new chip plant in China, which is also being co-funded by a state backed Rongkong Group. According to the DigiTimes report, sources close to the matter have revealed the multi billion dollar project investment that the Foxconn is making to build a new pant dedicated to provide advanced packaging technologies. This includes fan out and wafer level bonding and stacking for chip solutions
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The applications of these chips will be used in 5G networking and various AI related device applications as well. The source added that the upcoming Foxconn Qingdao plant will be ready for production in 2021 and is already planning on scaling up its output to commercial capacities by 2025. This new site is designed for a capacity of 30,000 12 inch wafers every month.
Furthermore, the move for a new plant from Foxconn is indicative of its efforts to grow its semiconductor business. It will also boost the company’s deployment that will have it make an impact on the semiconductor industry. Interestingly, Foxconn has also recently struck deals with China’s local governments for its participation in local chipmaking sectors.
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