A new leak has revealed the performance of the MediaTek Dimensity 1000C SoC. Reportedly, the chip marginally outperforms popular rivals in the segment like the HiSilicon Kirin 820 and Qualcomm Snapdragon 765G.
According to a post on Weibo, a Chinese microblogging website, the Dimensity 1000C is built on a 7nm process and features 4 ARM Cortex-A77 cores paired with another 4 ARM Cortex-A55 cores alongside the Mali-G57 GPU. The leak was shared by @数码闲聊站 on the popular Chinese social media platform with screenshots of performance scores of the processor through benchmarks.
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Furthermore, the Dimensity 1000C uses a MediaTek AI processing unit (APU 3.0) that runs the smartphone’s AI cameras, voice assistant, and other applications as well. As per the benchmark scores, it achieved 601 points on Geekbench 5’s single core tests and 2,365 points in the multi core performance test. In comparison, the Snapdragon 765G scores 607 points in single core tests but only 1,777 points in the multi core tests.
According to ITHome, the processor is being built specifically for the United States market. Interestingly, the chipset is also housed in the LG Velvet 5G T-Mobile variant. It is a mid range chip with performance being more similar to Dimensity 800 series chip over the higher end Dimensity 1000 chips. Although, it still beats the Snapdragon 765G and manages to rival the Kirin 820 SoC as well.
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