TSMC (Taiwan Semiconductor Manufacturing Company) recently held a ceremony, which marked the completion of its plant structure for its 3nm fab at the Southern Taiwan Science Park (STSP). This brings it closer to start production of 3nm process based chips.
This foundry house is expected to begin commercial mass production through the 3nm fab by the year 2022. Furthermore, with quotes for processing memory application going up in the semiconductor backend sector, the material costs have also risen. Notably, the world’s largest contract chip maker had also signed an agreement with Arm, which will have Taiwanese academic and research based firms enjoy free access to the latter’s processor IPs for research purposes, as per a DigiTimes report.
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Previously, we had also reported on the chip maker being on track with its schedule for the 3nm process. But soon after, the company announced a delay that shifted its risk production to next year and its mass production stage to 2022, as stated above. At the moment, TSMC stands at the forefront of the 3nm process, with other semiconductor giants like Samsung struggling to catch up with its progress. We’ll provide updates when more information is available so stay tuned.
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