After splitting up from Huawei Technologies a few months ago to run independently, Honor has made it a mission to surpass its former parent company and become one of the leading smartphone makers globally.
Recently, Honor’s Chief Executive Officer Zhao Ming revealed that the company will launch flagship smartphones this year and with that, it aims to surpass the Huawei Mate-series and P-series of flagship devices.
Now, a roadmap of the Honor devices for the current year has been leaked online which reveals when the mid-range and high-end devices from the brand will go official. It reveals that the flagship smartphone powered by Snapdragon 888 SoC will launch in July this year.
This is in line with the previous leak related to the premium high-end device from the brand. Further, it is revealed that the company will also launch its foldable smartphone around the same time.
Honor has been actively trying to build relations with other companies to strengthen its supply chain and production lines. It is reportedly working with AMD, Intel, Micron, Samsung, Qualcomm, Microsoft, and MediaTek for its upcoming devices.
Given that the company has separated from Huawei, it can now easily source required components from vendors which were earlier not possible under Huawei because of the sanctions imposed by the United States due to the on-going US-China trade war.
Honor is also in talks with Google to get GMS support. The company is also expanding its footprints, starting with its own Honor Mall online store and new offline stores. It will be interesting to see how Honor’s new devices perform in the market.
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