Xiaomi has given a detailed description of the cutting-edge heat dissipation technology deployed in the design of its latest premium and exquisite offering, the Mi Mix Fold smartphone.
In an article posted on Weibo, the versatile Chinese tech company explained how it finally overcame the heat dissipation challenge highly pronounced in foldable devices. A major problem with foldable smartphones is that the heat dissipation capacity is heavily dependent on the foldability status. It has been seen that the side of the device housing the SoC tends to accumulate more heat.
The Mi Mix Fold has begun sales in the Chinese market from April 16 and costs between 11,000 yuan and 13,000 yuan for the three variants available based on their memory capacity. Xiaomi says the Butterfly heat dissipation mechanism developed for the Mi Mix Fold enables efficient cooling from one side of the device to the other across the hinge mechanism.
The Mi Mix Fold smartphone comes with a raft of cooling mechanisms and heat-resistant materials that combine to make the Mi Mix Fold a masterpiece in the foldable segment. In fact, product testing revealed that the bend-resistant graphite sheet could retain its strength after several hundreds of thousands of 180-degrees bending.
The Mi Mix Fold is powered by Qualcomm’s Snapdragon 888 5G chipset, meaning that it has 5G support. The Snapdragon 888 is among the best high-end chips available. A 6.52″ and 8.01″ external and internal folding display are innovative components of the latest foldable from Xiaomi. The Mi Mix Fold has a 5,020mAh battery, capable of 67W fast charging. It features a camera system that includes a 108MP main camera with a liquid lens, a 13MP ultra-wide cam, and an 8MP telephoto camera.
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