Earlier today (13th May 2021), MediaTek officially announced the new Dimensity 900 5G chipset. The new mobile processor was the latest entry into the Dimensity lineup of 5G SoC and is built on a high-performance 6nm process node.
As per an official announcement, the new Dimensity 900 5G SoC arrives with support for Wi-Fi 6 standard, along with a 120Hz high refresh rate on FHD+ panels. Furthermore, the processor can also support 108-megapixel primary camera as well. According to Dr. JC Hsu, Corporate VP and GM of MediaTek’s Wireless Communications Business Unit, “Dimensity 900 brings a suite of connectivity, display, and 4K HDR visual enhancements to high-tier 5G smartphones and gives brands great design flexibility for their 5G portfolios.”
He further added that “The chipset’s support for 5G and Wi-Fi 6 ensures users get the most of out their devices with super-fast and reliable connectivity.” The Dimensity 900 chipset is also integrated with a 5G New Radio (NR) sub 6GHz modem with carrier aggregation and support for bandwidth up to 120MHz. The chip is an octa-core CPU, which consists of two ARM Cortex A78 processors that have a clock speed of up to 2.4GHz along with six ARM Cortex A55 cores that can reach up to 2GHz.
The MediaTek Dimensity 900 also supports LPDDR5 memory and UFS 3.1 storage as well and arrives with an integrated Arm Mali G68 MC4 graphics processing unit (GPU) and an independent AI processing unit (APU). Notably, the new AI processing unit in the chip is touted to be extremely power efficient and can support a wide variety of AI applications and 4K HDR as well.
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