Earlier today (2nd August 2021), HiSilicon, the Huawei chip subsidiary, announced its new self developed low latency image transmission technology in China. This technology is aimed to empower multi screen smart terminals and will support low memory usage and 4K UHD image quality on HiSilicon chips.

According to the Chinese tech giant, one of the highlighting features of HiAir is its ultra low latency transmission technology, which the company believes will be the industry benchmark in the next three years. Furthermore, this technology will also be integrated with Huawei Cast+, supports automatic device discovery, among others features like minimalist connection to offer a more enjoyable control experience.

Huawei HiSilicon FHD Chip for Smart TVs

It will also arrive with deep protocol optimization for Cast+, DLNA, Miracast, Lelink, and more. Notably, the new image transmission technology will also support low memory footprint and strong scalability as well. The technology also offers support for 4K UHD image quality as well, which would benefit streaming media, leading the industry’s image quality PQ standard. It even offers a high energy efficiency ratio as well since it only requires to be connected to a TV’s USB for power supply while the surface temperature does not exceed 40 degrees even with long hours of usage.

RELATED: