Earlier this month, MediaTek unveiled the Dimensity 9000 chipset. Now, the company has confirmed that it will be holding a press event on Dec. 16 in China. Since the chipset has been already unveiled, it is unlikely that some new details may get confirmed through the upcoming event. Probably, the names of the first Dimensity 9000 powered may get confirmed.
The Dimensity 9000 is the world’s first chipset to be manufacturer through TSMC’s 4nm process. It includes a single ARM Cortex X2 prime performance core that clocks at 3.05GHz, three Cortex-A710 cores that work at 2.85GHz, and four Cortex-A510 efficiency cores that ticks at 1.8GHz. The SoC includes a 10-core ARM Mali-G710 GPU.
The D9000 is equipped with a fifth-generation six-core APU for AI processing. It can support displays that support FHD+ resolution along with a 180Hz refresh rate. It comes with support for LPDDR5x RAM. The 18-bit ISP can shoot 4K HDR videos with three cameras simultaneously. Devices powered with D9000 can support a massive 320-megapixel camera.
The Dimensity 9000 supports connectivity options such as sub-6GHz 5G networks, Wi-Fi 6E, and Bluetooth 5.3. According to MediaTek Vice President of Corporate Marketing, Finbarr Moynihan that the Dimensity 9000 can deliver performance similar to the Apple A15 Bionic in multi-core benchmark tests. The first phones powered by the Dimensity 9000 chip is expected to launch in Q1 2022.
RELATED:
