Honor is reportedly working on the Honor Magic Fold foldable smartphone. The moniker is not final and it’s just the name that is being used by the rumor mill. A fresh leak by Chinese tipster Digital Chat Station reveals that the Magic Fold will come with Qualcomm’s flagship chipset.
According to the tipster, Honor is planning to launch phones powered by the Dimensity 9000, but they are not expected to launch soon. He added that the company’s first foldable screen smartphone is expected to release in January. He claimed that it will be powered by the Snapdragon 8 Gen 1 chipset.
The tipster did not share any other information on the specs of the Magic Fold but claimed it may cost around 10,000 Yuan (~$1,570). Last month, a tipster claimed that Honor will launch two foldable screen smartphones before spring in China. One of them will be a clamshell model, while the other model, which is being called the Honor Magic Fold, is likely sport a tablet-like device like the OPPO Find N or the Galaxy Z Fold series.
Shown above is the leaked render of the Magic Fold that surfaced earlier this week. Rumors have it that it will feature an 8-inch inner foldable screen, 8 GB of RAM, 256 GB of built-in storage, and a 4,500mAh battery with fast charge support. It may feature a 16-megapixel front camera and its rear camera setup may include a 108-megapixel main camera. The other specs of the Magic Fold are under the wraps.
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