Toshiba has recently announced that will be building a new wafer fabrication facility to boost its semiconductor manufacturing capabilities. With its new 300 millimeter site, the company is aiming on more than doubling its existing capacity.
The construction of the new semiconductor production site will be located in the Ishikawa Prefecture in Japan. This site will begin construction in Spring 2023 and is expected to be completed by the same season in the following year. The Japan based company added that the new site will enable its semiconductor manufacturing to rise by around 2.5 times compared to its 2021 capacity. The brand stated that the new fab will also feature a “quake absorbing” structure as well as dual power supply lines, artificial intelligence, and automated wafer transportation systems.
Furthermore, the plans for the new facility arrives amid an ongoing semiconductor shortage that has impacted various industries across the globe. One of these segments include automobiles, with carmakers struggling due to the chip shortage. Toshiba claimed that it had managed to meet the growing demand for chipsets by increasing the production on its 200 millimeter sites.
The company said that “Going forward, Toshiba will expand its power semiconductor business and boost competitiveness by timely investments and research and development that will allow it to respond to fast growing demand, and to contribute to a low energy society and carbon neutrality.”
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