At the ongoing Mobile World Congress, Qualcomm has announced its latest next-generation modem for smartphones –Qualcomm Snapdragon X70 5G. It comes with increased uplink and downlink speed as well as new features.
While not yet confirmed by the company, it is likely that Qualcomm will use this new model for the upcoming Snapdragon 8 Gen 2 chipset that is expected to go official this year.
The company says that the Snapdragon X70 can offer up to 10Gbps downlink speed and a peak 3.5Gbps upload speed, ensuring maximum performance. Do note that the real-world performance won’t be what the company is saying.
A major highlight for this new modem is that it uses artificial intelligence (AI) technology which improves the mmWave and sub-6GHz bands. It has an AI-based channel-state feedback and optimization algorithm to increase the average downlink and uplink speeds.
It uses AI-based mmWave beam management to increase the coverage and then uses an AI-based network selection algorithm. This latest baseband chip is also the first to support every commercial 5G band from 500MHz to 41GHz.
The Qualcomm Snapdragon X70 has support for global 5G multi-SIM and Dual-SIM Dual Active. The company claims that it is up to 60 percent more power-efficient, thanks to Qualcomm 5G PowerSave Gen 3 technology.
Qualcomm’s QET7100 Wideband Envelope Tracking and AI-based adaptive antenna tuning will also help in power conservation along with optimizing performance and latency. The company has revealed that the Snapdragon X70 modem is expected to launch in 5G devices by the end of this year.
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