Realme has been working on its upcoming device, the Realme 11 Pro, which has recently passed the TENAA certification with model number “RMX3770” in China. This certification has revealed some key features of the device, including a circular camera module and a centered punch-hole curved display.
As per the renders shared on the TENAA website, the Realme 11 Pro will come with a centered punch-hole display with a curved screen. Moving to the back of the device, it will sport a circular camera module with the primary camera sensor placed in the center, accompanied by two secondary lenses on either side and an LED flash above them. The design of the camera module is a departure from Realme’s previous rectangular camera modules, adding a new and unique look to the phone. The Realme branding is also there in the back panel.
Apart from this, according to a leak from Digital Chat Station, the Realme 11 Pro is expected to feature MediaTek’s latest Dimensity chipset with 5G and is likely to launch in May 2023. However, no further details regarding the specifications of the device have been revealed yet.
The device has also cleared TKDN and Bluetooth SIG certifications, suggesting that it will support Bluetooth 5.2 connectivity and will be available in Indonesia.
Realme has been known for providing feature-rich smartphones at an affordable price point, and the Realme 11 Pro is expected to continue that trend. With the latest MediaTek chipset and the curved punch-hole display, the device is expected to deliver a premium user experience.
Realme has not officially announced the launch date of the Realme 11 Pro yet, but the TENAA certification indicates that it could be soon.
RELATED:
- Realme GT Neo 5 SE Will Arrive With 16GB+1TB Storage Option
- Upcoming Smartphones: OnePlus Nord CE 3 Lite and Realme GT Neo 5 SE
- Realme Narzo N55 leaked image appears, launch date tipped
- Over 100,000 Realme C55 units were sold in just 5 hours after launch
- Realme Narzo N55 to Launch in India in April, Memory and Color options tipped
