Back in January, rumors emerged that the upcoming Xiaomi Civi 3 will feature the Dimensity 8200 chipset. The Dimsnity 8200 is a 5G SoC manufactured on TSMC’s 4nm process and powers smartphones like the Redmi K60e, Vivo V27 Pro, and Vivo S16 Pro. Now, Xiaomi has confirmed that the Civi 3 will come equipped with the Dimensity 8200 Ultra chipset, a custom variant of the Dimensity 8200.
The brand is yet to reveal the details about this custom chip. For context, the Dimensity 8200 features a total of eight cores, with one Cortex-A78 core clocked at up to 3.1 GHz, three Cortex-A78 cores clocked at up to 2.85 GHz, and four Cortex-A55 cores clocked at up to 2.0 GHz. It also has a Mali-G610 MC6 graphics processor. The Dimensity 8200 supports 5G connectivity with speeds up to 17 Gbps. It also supports Wi-Fi 6E and Bluetooth 5.3.
Previous reports have mentioned that the upcoming Civi 3 smartphone is anticipated to retain the 6.55-inch OLED display with curved edges, reminiscent of its predecessor, the Civi 2. On the front, users can expect a dual setup of 32-megapixel selfie cameras. The rear of the device will feature a primary camera from the Sony IMX800-series, known for its exceptional imaging capabilities.
Powered by the Dimensity 8200-Ultra chipset, the Civi 3 is likely to offer impressive performance and efficiency. It is expected to come with ample memory options, including up to 12 GB of RAM and a generous 512 GB of internal storage. Fast-charging enthusiasts will be pleased to know that the handset is rumored to support 67W fast charging, ensuring quick and convenient battery replenishment.
In an exciting development, a recent Weibo post unveiled that the Civi 3 will have a special edition version in collaboration with Disney, adding a touch of uniqueness and charm to the smartphone lineup.
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