Honor will unveil the Honor 90 and Honor 90 Pro smartphones on May 29 in China. Soon after its launch, the company reportedly plans to launch two other products, such as a mid-range phone called the Honor X50, and a foldable smartphone named the Honor Magic V2. The Magic V2 has been certified by China’s MIIT authority and is expected to debut in July in China. The X50 is expected to launch in June. The device has already been certified by China’s TENAA certification platform, through which its key specifications have emerged.
Honor X50 specifications (rumored)
The Honor X50, which has appeared with model number ALI-AN00 at TENAA, has 163.75.5 x 7.98mm dimensions and weighs 185 grams. The device is equipped with a 6.78-inch AMOLED display that offers a 1.5K+ resolution of 2652 x 1200 pixels and an in-screen fingerprint scanner. Like the Honor X40 from last year, the X50 may also support a 120Hz refresh rate.

The Snapdragon 6 Gen 1 chipset is said to power the Honor X50. The TENAA does not mention the name of the chip, but only states that it is powered by a 2.2GHz processor. It will arrive in RAM variants like 8 GB, 12 GB, and 16 GB.
The X50 will come in storage editions, such as 128 GB, 256 GB, and 512 GB. There is no microSD card slot on the device. It has a 5,700mAh (rated value) battery, which indicates that its typical capacity could be 5,800mAh.
The handset is expected to run on Android 13 OS and Magic UI 7. For selfies, it will feature an 8-megapixel camera. The dual-camera setup available on its back will have a 108-megapixel primary camera and a 2-megapixel auxiliary lens. There is no word on the design of the phone as its images have not appeared in TENAA’s database.
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