Honor and Oppo are gearing up to launch their latest flagship series of smartphones from the Magic 6 and Find X7 lineup respectively. But prior to their release, a new leak has revealed a couple of features that could be making their way to the new high end devices.
Honor Magic 6 & Oppo Find X7 Series Rumored Features
The news arrived from known tipster Digital Chat Station, who shared the information on Weibo (a Chinese microblogging website). The leaker claims that both premium grade smartphone series will feature a mini chipset for satellite communication technology, proprietary low power calling tech, and heat dissipation for improved performance.
The low power calling feature will likely compliment the satellite communication as an emergency contact method. Meanwhile, the heat dissipation technology will help lower thermal throttling to maintain high performance for longer with powerful chips like the Snapdragon 8 Gen 3 on the Magic 6 series. Just recently, we covered a report on Honor’s self-developed satellite communication technology.
Interestingly enough, the tipster is also doubling down on his previous claim of the Oppo Find X7 series featuring satellite communication. The Honor Magic 6 and Oppo Find X7 series could also include high end image technology, as per the tipster. Based on what we know so far, the Find X7 will also come with MediaTek Dimensity 9300 while the Find X7 Pro will be equipped with the Qualcomm Snapdragon 8 Gen 3 SoC.
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