Reports suggest Huawei‘s upcoming Mate 70 flagship will stick with the 7nm Kirin chips (potentially the Kirin 9100 with improved transistor density using SMIC’s N+3 technology) due to the high cost and potential yield issues associated with SMIC’s attempt at 5nm production using DUV. SMIC is China’s leading chipmaker, and it is facing limitations due to US sanctions and Dutch export restrictions. Unable to access cutting-edge EUV technology, SMIC relies on older DUV machines, putting them behind rivals TSMC and Samsung Foundry.
SMIC is reportedly actively working on a 5nm process using DUV lithography
Despite the challenges, rumors indicate SMIC is actively working on a 5nm process using DUV lithography. While the energy efficiency of this approach seems promising, significant cost reduction is necessary for it to be commercially viable for Huawei.
The Mate 70’s chipset choice remains unclear. Sticking with 7nm offers a safe path, while venturing into DUV-based 5nm promises advancement but carries significant risks. SMIC’s success in refining its 5nm process will ultimately determine Huawei’s chip strategy for future flagships.
(Via)
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