Several 2024 flagship smartphones are expected to launch this month, with many powered by MediaTek’s Dimensity 9400 chipset. In line with current trends, these brands are integrating numerous AI features into their custom skins, most of which are based on Android 15. But what about AI processing capabilities? According to official sources, the Dimensity 9400 is specifically designed to meet the demands of AI processing.
The chipset supports Google’s Gemini Nano with multimodality, featuring an 8th-generation NPU that offers hardware acceleration for text, image, and speech processing. This reportedly results in a 41% boost in AI capabilities compared to its predecessor. MediaTek has partnered with Google to ensure smartphone manufacturers can integrate more AI features, aiming to enhance user experience.
On-device processing ensures user privacy reduces network dependence
One key advantage of this improved NPU and support for on-device AI processing is enhanced user privacy and security, as more data will be processed locally rather than relying on cloud servers. On-device AI also reduces dependence on network connectivity for feature functionality.
Speaking of the implementation, Vivo’s Android 15-based OriginOS 5 custom skin is rumored to include AI-powered features such as voice transcription, real-time translation, beauty filters, and even AI-controlled NPCs to enhance gaming experiences. OriginOS 5 will debut with the vivo X200 series this month, powered by the Dimensity 9400.
Similarly, the Oppo Find X8 series, also featuring the Dimensity 9400, is expected to introduce new AI features like the “AI Note Assistant”, designed to simplify information storage and retrieval.
That said, the implementation of AI features still depends on the smartphone manufacturers and there’s not much information about the Android 15-based custom skins yet.
Aside from its powerful NPU, the Dimensity 9400 also brings substantial CPU and GPU improvements. The chipset is rumored to have a 1+3+4 core cluster consisting of a Cortex-X925 prime CPU core clocked at 3.626 GHz, three Cortex-X4 cores clocked at 2.80 GHz, and four power-efficient Cortex-A725 (or Cortex-A720) cores.
The Dimensity 9400 is fabricated using TSMC’s N3E (3nm) process node, which is expected to be 30% more power efficient than its predecessor.
(Source)
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