Honor is reportedly working on two foldable phones for the Chinese market: the Magic V4, a book-style foldable, and the Magic V2 Flip, a clamshell-style device. While rumours about the V4 have started surfacing, details about the flip phone remain scarce. In a recent development, an Honor executive has seemingly confirmed the chipset that will power the Magic V4.
Honor Magic V4’s chipset revealed
Oppo recently launched the Oppo Find N5 foldable phone in China and Southeast Asian markets. It is the world’s first device to feature the 7-core edition of the Snapdragon 8 Elite, which has one less performance core than the standard 8-core version. While this results in slightly reduced processing power for demanding tasks, the real-world performance difference may be minimal. The 7-core variant is typically designed for thinner devices with limited cooling capabilities, balancing efficiency and performance. Notably, the Find N5 measures just 4.2mm when unfolded and 8.9mm when folded, making it the world’s thinnest foldable phone.
Since the Honor Magic V3 previously held the title of the world’s thinnest foldable until the Find N5, the Magic V4 is expected to adopt an even slimmer form factor. In a recent Weibo post (shown above), a Chinese tech blogger speculated whether the Magic V4 would also feature the 7-core Snapdragon 8 Elite, given its ultra-thin design. In response, Honor’s Flagship Mobile Phone Product Manager, Li Kun, stated that it would be equipped with the “full-blooded” (machine-translated text) version of the chipset, suggesting that the Magic V4 could feature the standard 8-core Snapdragon 8 Elite.
The final naming of the device remains uncertain. Since Oppo skipped the “N4” moniker due to the number 4 being considered unlucky in some Asian countries, there is a possibility that Honor might also bypass the “V4” name and instead launch its next-generation foldable as the Magic V5. As far launch is concerned, it is expected to debut in June.
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