Samsung is expected to add a budget model in its foldable line called the Galaxy Z Flip 7 FE. The device is believed to have entered production and has also appeared in China’s 3C certification database, essentially confirming its existence. Now, it has gone through a benchmark test under the model number SM-F761N.
The listing confirms several details about the hardware, though it doesn’t settle the ongoing confusion around which chipset Samsung is actually using.
Galaxy Z Flip 7 FE Geekbench
The Geekbench entry lists the Flip 7 FE’s motherboard under the codename s5e9945, and the processor configuration suggests it is powered by the Exynos 2400 chip.
It includes a single prime core clocked at 3.21GHz, two performance cores at 2.90GHz, three additional cores running at 2.59GHz, and four efficiency cores at 1.96GHz. Handling the graphics is an Xclipse 940 GPU, which brings it to the point that it likely is Exynos 2400.
The device in testing has 8GB of RAM and is running Android 16, which is expected to be announced during Google’s I/O Developer Conference later this month. In the benchmark, it gained a single-core score of 1,930 and a multi-core score of 6,276.
That said, there’s still uncertainty around the final chipset choice of the FE. Geekbench now suggests it will be Exynos 2400, whereas earlier reports have floated the possibility of an Exynos 2400e or even an unreleased Exynos 2500.
Adding to the confusion, a separate report from earlier today claims that the 7 FE may not use an Exynos chip at all.
Of course, these are leaks, and leaks can be inaccurate. So we suggest you take these details with a pinch of salt. Aside from the benchmark, 3C certification reveals the device will support 25W fast charging.
For more daily updates, please visit our News Section.
Stay ahead in tech! Join our Telegram community and sign up for our daily newsletter of top stories!
(Source)
Comments