Announced in November 2024, the Dimensity 8350 is a high-performance mobile chipset from MediaTek, featuring an 8-core CPU with up to 3.35GHz maximum frequency and a Mali-G615 MP6 GPU for visual rendering. The chipset does a pretty good job at handling resource-intensive tasks while offering excellent battery efficiency.
The Snapdragon 8 Gen 3, on the other hand, was announced a year before the Dimensity 8350, but it’s still a popular choice among flagship devices. The chip rocks more powerful CPU cores and a capable Adreno 750 GPU that excels at graphics rendering. But which chipset outperforms the other? Let’s deep dive into the benchmarks, key strengths, and weaknesses to see how the Dimensity 8350 and Snapdragon 8 Gen 3 stack up against each other.
Dimensity 8350 vs Snapdragon 8 Gen 3: Benchmark comparison
Note: The following benchmark tests were conducted on the Oppo Reno 13 (Dimensity 8350) and Xiaomi 14 Ultra (Snapdragon 8 Gen 3).
AnTuTu score
The Snapdragon 8 Gen 3 delivers a commanding lead over the Dimensity 8350, posting a total score of 1,937,417 — roughly 43% higher than the 8350’s 1,352,732. The performance gap is evident across all components. In the CPU test, the Snapdragon chip scores 419,604 versus the Dimensity’s 289,855 — a 45% boost in processing power.
The GPU difference is even more striking: 829,698 on the Snapdragon 8 Gen 3 compared to 513,784 on the Dimensity 8350, marking a 61% jump in graphics performance, which directly benefits gaming and heavy visual workloads. The Snapdragon chip also pulls ahead in memory (382,043 vs 278,071) and UX (306,072 vs 271,022) tests.
| Dimensity 8350 | Snapdragon 8 Gen 3 | |
|---|---|---|
| AnTuTu score | 1,352,732 | 1,937,417 |
| CPU | 289,855 | 419,604 |
| GPU | 513,784 | 829,698 |
| Memory | 278,071 | 382,043 |
| UX | 271,022 | 306,072 |
Geekbench score
The Snapdragon 8 Gen 3 again outpaces the Dimensity 8350 by a significant margin. It scores 2,185 in the single-core test, which is about 63% higher than the Dimensity 8350’s 1,342. This means much faster responsiveness in everyday tasks like app launches, web browsing, and UI interactions.
The multi-core performance tells a similar story. The Snapdragon chip delivers a score of 6,735 compared to the Dimensity 8350’s 4,028 — a massive 67% improvement, which translates to smoother performance in heavy multitasking, gaming, and demanding apps.
| Dimensity 8350 | Snapdragon 8 Gen 3 | |
| Single core | 1,342 | 2,185 |
| Multi core | 4,028 | 6,735 |
Dimensity 8350 vs Snapdragon 8 Gen 3 — key differences you should know
Performance
Both chips feature eight CPU cores and utilize TSMC’s 4nm manufacturing facility, but there are significant differences beneath the surface. For instance, the Dimensity 8350 features four Cortex-A715 performance cores and four Cortex-A510 efficiency cores, while the Snapdragon chip rocks more performance-friendly and efficient cores — one Cortex-X4 large core, five Cortex-A720 performance cores, and two Cortex-A520 efficiency cores. The latter also benefits from a larger cache memory.
For graphics rendering, the Dimensity chip features a Mali-G615 MP6 GPU. It offers a higher peak frequency, but the Adreno 750 GPU on the Snapdragon chip performs better overall, thanks to its larger shading units, total shaders, and floating-point operations per second (FLOPS). That’s also reflected in benchmark scores.
Both chipsets also feature NPU for on-device AI capabilities. The Dimensity chip features a MediaTek NPU 780, which offers 8 times faster generative AI and 3.3 times faster AI performance compared to its predecessor. It’s also twice as fast in terms of integer and floating-point compute improvement.
On the other hand, the Qualcomm chip features a hexagon NPU, which offers 98% better performance and 40% higher performance per watt compared to its predecessor. It supports generative AI models with up to 10 billion on-device parameters, the same as the Dimensity 8350.
Connectivity
The Dimensity 8350 features a built-in 5G modem with a maximum download speed of up to 5.17Gbps, while the Snapdragon 8 Gen 3 (with X75 5G modem) offers a significantly higher peak download speed of 10Gbps.
The Snapdragon chip also offers higher speed on Wi-Fi connections, thanks to Wi-Fi 7 support, whereas the Dimensity 8350 supports Wi-Fi 6E. Both chipsets come with all the necessary positioning systems and the same Bluetooth 5.4 standard.
In short, both chips offer necessary connectivity features, which is sufficient for most users, but the Snapdragon chip unlocks higher connection speed.
Camera
The camera also brings several key differences that you should be aware of. The Dimensity 8350 features a 14-bit HDR ISP with support for up to 320MP resolution. It can record up to 4K/60fps HDR video. The chip also features a range of camera features, including Video HDR, Video Bokeh, Video EIS, Video NR, and AI Color for Capture.
The Snapdragon chip has an 18-bit triple ISP that supports a maximum resolution of 200MP. It allows up to 8K/30fps or 4K/120fps video recording and features a host of camera features, such as Truepic photo capture, Mega Low light photography, Engine for Visual Analytics 3.0, Video super resolution, and more. Additionally, the Snapdragon 8 Gen 3 enables real-time semantic segmentation for photos and videos (up to 12 layers) for detailed optimizations.
Display, memory, and storage
The Dimensity 8350 allows WQHD+ screen resolution at 120Hz refresh rate and FHD+ resolution at 180Hz. The Snapdragon chip, however, allows a higher 4K Ultra HD resolution at 60Hz and QHD+ at 144Hz.
Both chipsets bring UFS 4.0 storage and LPDDR5x memory, but the Snapdragon chip allows the memory to run at a higher speed (4.8GHz vs 4.2GHz), offering additional performance boost.
Dimensity 8350 vs. Snapdragon 8 Gen 3: which is better?
While both the Dimensity 8350 and Snapdragon 8 Gen 3 are powerful chips built on a 4nm process, the Snapdragon 8 Gen 3 clearly stands out as the more capable performer. It consistently outpaces the Dimensity 8350 in all benchmark tests — AnTuTu, Geekbench, and GPU performance — and offers more advanced CPU architecture, faster memory speeds, and superior connectivity features like Wi-Fi 7 and higher 5G download speeds.
That said, the Dimensity 8350 still holds strong as a solid upper mid-range chipset, delivering reliable performance, excellent power efficiency, and rich camera capabilities for most users. But if you’re after flagship-tier speed, gaming, and cutting-edge features, the Snapdragon 8 Gen 3 is the obvious choice.
| Dimensity 8350 | Snapdragon 8 Gen 3 | |
|---|---|---|
| Announced | November 2024 | October 2023 |
| Process node | 4nm | 4nm |
| Manufacturer | TSMC | TSMC |
| CPU | 1 x 3.35GHz — Cortex-A715 3 x 3.2GHz — Cortex-A715 4 x 2.2GHz — Cortex-A510 | 1 x 3.3GHz — Cortex-X4 3 x 3.15GHz — Cortex-A720 2 x 2.96GHz — Cortex-A720 2 x 2.27GHz — Cortex-A520 |
| GPU | Mali-G615 MP6 GPU Hardware ray tracing support MediaTek HyperEngine Adaptive Gaming Technology | Adreno 750 GPU Hardware ray tracing support Snapdragon Elite Gaming features |
| NPU | MediaTek NPU 780 | Qualcomm Hexagon NPU |
| Storage Memory | UFS 4.0 LPDDR5x — 4.2GHz | UFS 4.0 LPDDR5x — 4.8GHz |
| Camera | MediaTek Imagiq 980 HDR ISP (14-bit) Up to 320MP camera resolution Up to 4K/60fps video recording | Qualcomm Spectra Cognitive Triple ISP (18-bit) Up to 200MP camera resolution Up to 8K/30fps video recording Real-time semantic segmentation (max 12 layers) |
| Connectivity | MediaTek 5G modem Download speed: 5.17Gbps (max) Wi-Fi 6E Bluetooth 5.4 | Snapdragon X75 5G modem Download speed: 10Gbps (max) Wi-Fi 7 (peak speed: 5.8Gbps) Bluetooth 5.4 |
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