Samsung is looking to shatter the Exynos curse with its 2027 flagship processor, the Exynos 2700. Codenamed Ulysses, the chip is expected to be a pivotal component for the Galaxy S27 series, focusing on solving the persistent thermal and efficiency issues that have historically plagued Samsung’s in-house silicon.
Exynos 2700 Specs (Rumored)
According to recent leaks from tipster Kaulenda, the Exynos 2700 will be built on Samsung Foundry’s second-generation 2nm process, known as SF2P.
This cutting-edge node utilizes a refined Gate-All-Around (GAA) architecture, which is projected to deliver a 12% performance boost and a massive 25% reduction in power consumption compared to the upcoming SF2-based Exynos 2600. The transition to SF2P could allow the chip’s prime CPU core to reach a stable clock speed of 4.2 GHz.
Architecturally, the Exynos 2700 is rumored to adopt ARM’s next-generation C2 cores, likely labeled as C2-Ultra and C2-Pro. This shift could result in a 35% gain in instructions per clock (IPC), pushing Geekbench 6 scores to an impressive 4,800 in single-core and 15,000 in multi-core tests.
To tackle heat, Samsung is reportedly introducing FOWLP-SbS (Side-by-Side) packaging. Unlike traditional vertical stacking, this layout places the die and DRAM horizontally under a unified copper-based Heat Path Block. This design increases the contact area for the heatsink, significantly improving thermal dissipation during heavy workloads.
The graphics side will also see a transformation. Pairing a next-gen AMD-based Xclipse GPU with LPDDR6 memory (supporting up to 14.4 Gbps) and UFS 5.0 storage, the chipset could see data transfer speeds nearly double.
This synergy is expected to yield a 40% jump in graphics performance, positioning the Exynos 2700 as a formidable rival to Qualcomm’s Snapdragon 8 Elite Gen 6 and a potential ticket for Samsung to regain its silicon independence.
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