Among the two rumored flavors, Qualcomm is expected to bring LPDDR6 RAM and a full-fledged GPU for only the Snapdragon 8 Elite Gen 6 Pro. A newly leaked block diagram now suggests the Pro chip may also have another exclusive feature: an HPB design.
According to a leak from China, Qualcomm is expected to adopt Heat Pass Block (HPB) technology, the same cooling method used in Samsung’s Exynos 2600. Instead of relying on more traditional layouts, HPB places a dedicated heat-spreading layer directly on top of the chipset package. The goal is to move heat away from the silicon faster, before it becomes a performance bottleneck.

Qualcomm’s recent chips have aimed for extremely high peak frequencies, with rumors suggesting the Snapdragon 8 Elite Gen 6 Pro could reach even 6GHz. Sustaining those speeds has been a challenge in the past, often forcing the chip to throttle down once temperatures rise. HPB is designed to reduce that problem by giving the processor more thermal headroom.
Snapdragon 8 Elite Gen 6 Pro to use Package-on-Package memory
The schematic leak also reveals other technical details. The Snapdragon 8 Elite Gen 6 Pro appears to use a Package-on-Package (PoP) design, where memory is stacked closely with the processor to save space.
The chip supports both LPDDR6 and LPDDR5X RAM along with UFS 5.0 storage using two high-bandwidth lanes.
Beyond raw performance, the chip may also focus on productivity features. The leak hints at multi-display support, which could enable desktop-style experiences when phones are connected to external monitors.

If true, the leak suggests Qualcomm is seriously rethinking how it handles heat in its most powerful chips. Adopting HPB could help the Snapdragon 8 Elite Gen 6 Pro maintain high performance for longer periods, instead of briefly hitting impressive numbers before slowing down.
That said, it’s still unclear whether this cooling solution will be exclusive to the “Pro” variant. There’s no confirmation yet that the standard Snapdragon 8 Elite Gen 6 will receive the same treatment.
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