Last year, Xiaomi launched the Xiaomi 15s Pro powered by its homegrown Xring O1 chip. There have been reports that the brand is now working on a successor version of the chip dubbed the Xring O3. Speculation suggests that the Xring O3 may debut as early as this year, possibly powering the upcoming Xiaomi 17 Fold (tentative name) foldable smartphone. Now, a new leak reveals that it may also power the next-generation Ultra-branded flagship phone.
Xiaomi’s mysterious Ultra flagship with Xring O3 in the works
Tipster Yogesh Brar suggests that Xiaomi is working on a new Ultra-branded smartphone powered by its in-house Xring O3 chipset. The report indicates that this device is being developed alongside the upcoming Xiaomi 18 Ultra, which is still expected later this year.
The new Xring O3-powered Ultra model is said to be a separate offering from the 18 Ultra, raising questions about its positioning within Xiaomi’s flagship lineup. It is also being suggested that this device may remain limited to China, with no plans for a global rollout at this stage.
What’s known about the Xring O3?
Reports have revealed that the Xring O3 will arrive with a simplified yet more powerful architecture. It is expected to shift to an octa-core design, moving away from the earlier 10-core layout. The new setup may include a Prime core clocked at up to 4.05GHz, Titanium cores at around 3.42GHz, and efficiency-focused little cores reaching 3.02GHz.
The GPU is also tipped to improve, nearing 1.5GHz frequencies. Memory speeds may remain unchanged at 9600 MT/s. Overall, these changes are likely aimed at improving multitasking, background processing, and sustained performance efficiency across demanding workloads.
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