China’s CXMT (ChangXin Memory Technologies) appears to be accelerating its roadmap for next-generation memory. The company has reportedly begun sampling its LPDDR6 chips while also preparing its manufacturing supply chain well ahead of the commercial arrival of DDR6 memory.
CXMT prepares for the DDR6 era
CXMT has reportedly added Haesung DS as a new packaging substrate supplier to support its transition toward DDR6 memory production. The company is also shifting from the conventional reel-to-reel manufacturing process to panel-level packaging, which is better suited for the complex multi-layer designs required by DDR6.
Unlike DDR4 and DDR5, DDR6 memory requires a significantly higher number of substrate layers and greater manufacturing precision. While reel-to-reel production can technically support DDR6, increasing circuit layers reduce production efficiency and profitability. Panel-level packaging is expected to offer a more practical approach for large-scale manufacturing of next-generation memory.
CXMT’s LPDDR6 memory has reportedly already entered the sampling stage. The company is preparing its production lines ahead of mass manufacturing, which is reportedly expected to begin in the second half of 2026. The LPDDR6 chips are said to offer data transfer speeds of up to 12.8Gbps, placing them alongside flagship offerings from Samsung and SK Hynix.
Although DDR6 is not expected to enter commercial deployment until 2028 or 2029, CXMT has already begun strengthening its supply chain. Haesung DS reportedly received qualification for CXMT’s DDR5 packaging substrates during the first quarter of 2026, laying the groundwork for the company’s future DDR6 production plans.
CXMT is currently the world’s fourth-largest DRAM manufacturer with an estimated market share of around 7.7 to 8 percent and monthly wafer production of roughly 300,000 units at its Hefei facility.
As Samsung and SK Hynix continue allocating more capacity to HBM memory, the resulting supply constraints in the conventional LPDDR market could create an opportunity for CXMT. Its memory products are already supplied to brands such as Huawei, Xiaomi, and Oppo, while Alibaba Cloud and Tencent Cloud are also among its customers.
Reports also suggest that Apple is testing CXMT’s memory chips, which could pave the way for entry into the company’s global supply chain if certification is secured.
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