Xiaomi just officially unveiled its latest flagship mobile chipset, the Xring O3, and the early independent tests are already making headlines. Building on last year’s solid Xring O1, this new processor is getting a lot of attention for packing strong performance with better efficiency.
According to tests from Chinese outlet Xiaobai’s Tech Reviews (run on what looks like a reference design), the Xring O3 scores 3,854 in Geekbench single-core. That’s roughly in the same ballpark as the Snapdragon 8 Elite Gen 5 and Apple’s A19 Pro, and about 25% better than the previous Xring O1.
The multi-core numbers are even more eye-catching. Its 10-core CPU hits 15,086 points, well clear of the highest Snapdragon 8 Elite Gen 5 scores seen in similar tests (which stayed under 12,000 on devices like the iQOO 15 Ultra). That’s roughly a 55% jump over the Xring O1. And it’s doing all this while being more power-efficient than Qualcomm’s current top silicon.
Graphics performance follows the same trend. In 3DMark’s Steel Nomad Light test, the Xring O3 comes in more than 40% higher than current flagship chipsets and up to 90% higher than last year’s Xring O1. Again, the gains come with better efficiency on a performance-per-watt basis.
What’s especially interesting is that the Xring O3 is built on TSMC’s N3P process, not the newer N2 node that Qualcomm, Apple, and MediaTek are expected to use for their next flagships. Even so, the early data suggests Xiaomi’s chip is in a good position to compete with those upcoming designs. Xiaomi has confirmed the Xring O3 will power devices including the Xiaomi 18 Fold and the Pad 9 Pro Max.
It’s worth keeping in mind that these benchmarks were run on a prototype or reference platform, so they could reflect optimistic conditions. Real-world performance in actual shipping phones will depend on cooling, sustained power limits, and software tuning. Still, the early numbers look promising for Xiaomi’s second-generation custom silicon.
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