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Samsung has not yet shown its 2027 flagship chip, but the Exynos 2700 is now reportedly in mass production. According to tipster Ice Universe, Samsung Electronics is making about 10% more units than it did with the previous generation.
The claim is in line with previous reports that the chip production would begin in the second half of 2026. It is set to debut in the Galaxy S27 series and will use Samsung’s second-generation 2nm process, called SF2P. Compared with the previous generation, it is said to offer 12% higher performance and 25% lower power use.
Exynos 2700: What we know
The Exynos 2700 will reportedly be the first Samsung chip to use FOWLP-SbS, short for fan-out wafer-level side-by-side packaging. Here, the processor and memory sit next to each other under a copper-based heat path block. This lets one piece of metal pull heat away from both the application processor and the DRAM. Samsung reportedly sees this as a more efficient setup than the Exynos 2600, where a heat sink touched the chip directly.
As for the core layout, the CPU will have ten cores with two prime clusters.
- First cluster: one Arm C1-Ultra core at 3.36GHz and four C1-Pro cores at 2.88GHz. This group handles sustained workloads and efficiency.
- Second cluster: one C2-Ultra core at 4.24GHz and four C2-Pro cores at 3.74GHz.
For graphics, Samsung is likely to use the Xclipse 970, built on AMD’s RDNA 5 architecture. It has 16 compute units, and you can expect GPU performance to rise by 30% to 40%. On the memory side, the chip supports LPDDR6 RAM and UFS 5.0 storage, which should raise data transfer speeds.
Samsung has not confirmed any of these details, so treat them as unverified until official.
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