heat dissipation Archives - Gizmochina

OnePlus 10 Pro to feature brand’s biggest & strongest ever heat management system

Sean — Wed, 05 Jan 2022 09:49:21 +0000

Earlier today (5th January 2022), the OnePlus 10 Pro was teased again prior to its launch. But rather than sharing an image poster, a company executive shared images of the internal components of the device to showcase its thermal management system.

The images of the OnePlus 10 Pro parts were shared by the brand’s Research and Development Director @刘丰硕 (Liu Fengshuo) on his official Weibo account (a Chinese microblogging website). In the social media post, the official stated that the performance of mobile processors has continued to rise, which has led to power consumption increase as well. Furthermore, more power also means more heat being generated.

Thus, the executive showcased the cooling components of the OnePlus 10 Pro, which houses Qualcomm’s latest and greatest, Snapdragon 8 Gen 1. The overall area the cooling plate takes up is around 34119.052mm², which is the largest ever on any OnePlus device. It even arrives with VC cooling plate alongside copper graphite sheet, and heat dissipation silica gel as well. The company also stacks these various cooling components to efficiently dissipate heat from the smartphone.

Notably, in the live images shared by Liu Fengshuo, we can see the smartphone’s thermal management parts being compared to an A4 sized sheet of paper as well. Stacking them against each other, the official said that the cooling components take up around 55 percent of the size of the sheet. The official stated that the OnePlus 10 Pro cooling mechanism is the strongest ever from the brand and will help keep the device cool even during intensive tasks.

Xiaomi announces Loop LiquidCool Technology with twice the heat dissipation capacity of VC

Jeet — Fri, 05 Nov 2021 09:07:49 +0000

Premium smartphones nowadays come with powerful internals, making the device suitable for heavy or intensive tasks such as gaming. With increased performance, the company also needs to take care of heat dissipation to ensure a smooth experience.

In line with that, Xiaomi has today introduced a new heat dissipation technology called Loop LiquidCool Technology. The company says that it is inspired by the cooling solutions used in the aerospace industry.

The Loop LiquidCool Technology utilizes a capillary effect which draws liquid cooling agent to the heat source, vaporizes, and then disperses the heat efficiently towards a cooler area until the agent condenses and is captured via a unidirectional closed-looped channel.

It features an annular heat pipe system that is composed of an evaporator, a condenser, a refill chamber, as well as gas and liquid pipes. Placed at heat sources, the evaporator has a refrigerant that evaporates to gas when the smartphone is under high workload. The gas and airflow are then diffused to the condenser, where the gas condenses into liquid again. These liquids are absorbed and collected through tiny fibers in the refill chamber—which refills the evaporator—making it a self-sustaining system.

The conventional VC systems do not have separate channels for gases and liquids, hot gas and cool liquids mix and obstruct each other. The ring-shaped pump features a special gas pipe design, which greatly reduces air passage resistance by 30% and the maximum heat transfer capacity is increased by up to 100%.

It adds a Tesla valve, which is a one-way valve that allows liquid to pass through the evaporator while blocking gases from moving in the incorrect direction. This allows for higher efficiency in gas/liquid circulation throughout the system.

This also makes it possible to adopt and stack Loop LiquidCool Technology into any type of internal design. Giving an example, Xiaomi says that a square-shaped loop will allow more space for the battery, camera module, and more.

The company claims that it offers twice the cooling capabilities compared to the conventional vapor chambers (VC) solutions. Xiaomi is now aiming to bring this Loop LiquidCool Technology to its products in the second half of next year.

Nubia teases Red Magic 6S Pro’s cooling system again, features space grade materials

Sean — Tue, 31 Aug 2021 07:37:13 +0000

Earlier today (31st August 2021), Nubia shared another teaser for its upcoming Red Magic 6S Pro gaming smartphone. The new teaser showcased its heat dissipation system again, but this time, the company revealed the aerospace-grade phase change material used in the device.

Previously, the Chinese smartphone maker had shared a teaser that highlighted two key components of the Red Magic 6S Pro’s thermal management systems. This included aerospace level heat dissipation black technology, which is an aviation-grade aluminum that is used in a surface of up to 18,000 square millimeters inside the handset to reduce the CPU’s core temperature by around 16 degrees Celsius and even reduce the temperature of the smartphone’s body as well. Furthermore, the brand had even talked about the new turbo cooling fan, which can spin at a speed of up to 20,000 RPM.

Now, the company has revealed that the unique aerospace-grade heat dissipation technology used in the upcoming device is the material n-ecosane C21H44. For those unaware, this material is a compound that has a melting point of about 39 to 41 degrees Celsius. Notably, the material is also soluble in water and appears to have practical applications for smartphones’ heat dissipation systems as well.

While Nubia only hinted at the cooling system of the Red Magic 6S Pro again, we already have confirmation that the device will house a Qualcomm Snapdragon 888+ SoC along with support for 165Hz high refresh rate display and a triple camera module on the rear. Unfortunately, not a lot of information is available regarding this handset so stay tuned as we will be covering its 6th September 2021 launch event.

Nubia teases Red Magic 6S Pro, will sport aerospace level heat management tech

Sean — Mon, 30 Aug 2021 07:22:52 +0000

Earlier today (30th August 2021), Nubia shared a new teaser for its upcoming Red Magic 6S Pro gaming smartphone. In the new teaser, the company showcases the device’s advanced heat dissipation system that will help keep thermals in checkThe Chinese smartphone maker shared the teaser on its official Weibo account, a Chinese microblogging website. In the social media post, the brand shared two image posters that highlighted two key components of its thermal management system. The first was aerospace level heat dissipation black technology, which is basically a unique aviation grade aluminum that is used in a surface of up to 18,000 square millimeters inside the handset that helps reduce the CPU’s core temperature by 16 degrees Celsius and even reduce the temperature of the smartphone’s body as well.

Furthermore, the second major component of the thermal management system includes its built in turbo cooling fan. This fan spins with a speed of up to 20,000 RPM. Although, since it is powered by a brushless motor, the company assures that the maximum noise levels from this fan would only be 28 decibels. Previously, Nubia had also revealed that its latest smartphone will feature Qualcomm Snapdragon 888+ SoC along with 165Hz refresh rate. Notably, the device is set to be unveiled on 6th September 2021, so stay tuned for more updates.

Meizu 16 to Use Copper Tube Heat Dissipation To Utilize The Full SD845 Power

Michele Ingelido — Wed, 20 Jun 2018 03:00:00 +0000

Despite Meizu 15 series having just hit the market, soon the Chinese company will unveil another line-up of flagship smartphones: Meizu 16. In a recent interview, the company’s founder Huang Zhang has indeed revealed that the Meizu 15 released to celebrate the 15th anniversary of the company is just a test, while the 16 will be the ultimate product. Now, the founder has also revealed that the upcoming flagship series will feature a special heat dissipation system working through a copper tube.

This would not be the first time we see such a dissipation system: other smartphones featuring it are the 2017 Razer Phone and even the older Samsung Galaxy S7 and S7 Edge. This system will be present in order to push the octa-core Snapdragon 845 SoC by Qualcomm to the maximum without overheating. In case you don’t know, the company had previously confirmed that at least one variant of the Meizu 16 line-up will feature the Snapdragon 845 SoC, which will make it the first Meizu flagship to feature a top-end Qualcomm chipset.

The handset is also tipped to come with 8 GB of RAM, but probably this amount of memory will be an exclusive for the Plus variant. Indeed, according to rumors, the standard version will pack the lower-end chipset Snapdragon 710 which remains a high-end SoC even though it is not at the same level of SD845. Meizu 16 will be officially unveiled in August, but the founder Huang Zhang will not attend the event, it should have either the Vice President Li Nan or Yang Wei as the main star.

Thanks to the new heat dissipation system, the flagship should be able to achieve impressive performance in gaming or with heavy apps and multi-tasking. No words have been spoken until now about the availability and price of the upcoming flagship.

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