Le Max Pro holds the title of the world’s first Snapdragon 820 smartphone, but despite its announcement back in January, the phone was not yet available for sale. However, earlier today, LeEco announced that the Le Max Pro with SD820 on board will also be the first phone with this chip to go on sale.

The company made limited 1000 units of the flagship available for purchase to its fans today at 12:00 PM (Feb 23). These are not commercial versions of the device, rather engineering models. So, it looks like the company rushed the sale as it wanted to bag the title of “first SD820 smartphone to go on sale”.

Now, coming to the most surprising part of the sale. The Le Max Pro engineering models are being sold at a throwaway price of 1999 Yuan ($306). We call it throwaway price because many rumors suggest that the commercial version of the phone is going to go on sale for a price around $500. In fact, the company claims that it incurs a loss on the sale of each unit. What’s more, the company is offering a number of add-ons like subscription to 3 months of LeTV Music. So, if you happen to live in China, this would have been a great opportunity to get your hands on this beast.

As for the specs, the powerful Le Max Pro comes with Snapdragon 820 chip under the hood with Adreno 530, 4GB LPDDR4 RAM and 64GB of internal storage. At the back, you have a large 21MP sensor while up front, you will find a 4MP Ultrapixel shooter. The screen is massive, measuring 6.33-inches with 2K resolution. Inside, you have a 3400mAh battery to power these specs. Other notable features of the phone include Qualcomm’s Ultrasonic Fingerprint sensor (at the back), Hi-Fi audio, Dolby sound, and dual card dual standby.

At 1999 Yuan, the Le Max Pro was really a steal deal! However, at the time of publishing this article (an hour after the sale), the phone would most likely be sold out.

Considering the specs on board, how much would you be willing to pay for the commercial version of the Le Max Pro?

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Its been more than a month since LeEco announced the world’s first Snapdragon 820 powered smartphone, Le Max Pro. However, until now, the company has not yet revealed when the phone will go on sale. We all have been waiting to hear the news, and the new teaser from the company did come as a relief to some extent. The new teaser is probably for the international launch of the Le Max PRo and the subsequent release of the device.

However, if you can’t wait for the official announcement, here’s some interesting rumor. Now, it is being said that the Le Max Pro could be made available for sale globally on February 23, a day before the Xiaomi Mi 5 officially launches.

The rumor comes via the famous leakster from China, Upleaks. Apparently, he had revealed a set of numbers on his weibo page yesterday: “223,120,036,991,000”. At that time, it didn’t make any sense. However, thanks to one weibo user, it looks like these numbers actually make a lot of sense.

So, these numbers could mean that the Le Max Pro will go on sale on 2/23 i.e. February 23 at 12:00 PM, for a price tag of 3699 Yuan ($567) and only 1000 limited units will be made available for sale on that day. While we are not entirely sure whether this will turn out to be true, since LeEco is yet to make these details official, it would actually make sense for LeEco to make the phone available for purchase a day before Mi 5 releases. It would then beat Xiaomi not only by becoming the first manufacturer to announce a SD820 device but also the first maker to release the device in the market.

The phone features powerful specs, including a 6.33-inch 2K display, 4GB RAM, 21MP rear camera, SD820, ultrasonic fingerprint sensor, USB Type-C and 3400mAh battery. For these specs, would you be ready to shell out $567?

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LeEco managed to become the first smartphone manufacturer to announce a Snapdragon 820 powered smartphone. This was indeed a big feat for the company, since it entered the industry only a few months earlier. However, even after the phone’s announcement, the company didn’t reveal any details about Le Max Pro’s market release, which led to many questions. One of the most important question brought forward by fans was whether Xiaomi Mi 5 will beat Le Max Pro to a market release.

Looks like that won’t likely happen, as LeEco has just released a new teaser via its official Weibo page. The teaser gives us a date, Feb 22, which could hint an international release of the device. Further, we have another date on the teased image, Feb 24, which could be when the phone finally becomes available for sale. In case you remember, Feb 24 is the same day that Xiaomi Mi 5 launches, so LeEco might have purposely chosen this date for a market release of the Le Max Pro.

One things certain, by the start of March, we will have a number of Snapdragon 820 powered smartphones available for purchase. Le Max Pro, Samsung Galaxy S7 and Xiaomi Mi 5 might be some of the few devices powered by SD820 that we will see at the event.

RELATED: Le x820 Scores More Than 141K on AnTuTu

To recap, the Le Max Pro features a massive 6.33-inch 2K display with 4GB RAM and 64GB of internal storage. At the back, there will be a 21MP camera with OIS while up front, you will find a 4MP sensor. Other highlighted features of the device include Qualcomm’s Ultrasonic Fingerprint sensor, USB Type-C, VoLTE, and Dolby Atmos Audio.

As for the pricing, we still have no official word. But rumors suggest that the phone could be quite costly, retailing at somewhere around $535.

The post LeEco Releases Another Teaser, Could It Be For Le Max Pro’s Market Release? appeared first on Gizmochina.

LeTV, now known as LeEco showcased its new flagship smartphone, the Le Max Pro at CES 2016. It is the first Snapdragon 820 powered smartphone to be launched in the market. However at the event, the company failed to give out details about the phone’s availability or market release.

Now, it looks like, Le Max Pro is all set to enter the Chinese market as it has passed through TENAA, the Chinese equivalent of US’s FCC. Once a device gets TENAA certification, you can expect it to be available in China pretty soon.

TENAA listing reveals that the Le Max Pro will be powered by the quad-core 2.2GHz Snapdragon 820 chipset with 4GB of RAM on board and 64GB of internal storage. There will be a massive 6.3-inch display with 2K resolution. At the back, you will find a 21MP camera, while up-front, there’s a 4MP Ultrapixel camera.

Apart from being the first phone with Snapdragon 820, the phone also boasts of being the first smartphone with Qualcomm’s Ultrasonic fingerprint sensor, Sense ID. The sensor is located at the back of the device. Inside, you will find a decent 3400mAh battery on board with fast charging.

Other features include dual SIM dual standby, bezelless design, 167×93.4×8.95mm dimensions, and Android 6.0 Marshmallow OS out of the box. As for the design, its almost similar to the design philosophy of the previous generation LeTV smartphones with an all metal body.

As you can see, the phone is quite powerful. But we will have to wait and watch whether upcoming smartphones like Xiaomi Mi 5 and the Samsung Galaxy S7 beat the Le Max Pro in terms of performance. Both the devices are expected to be unveiled in the second half of February with Snapdragon 820 chip on board.

Pricing is still unclear, but rumors say that the Le Max Pro will be priced around 3499 Yuan ($535) which is actually quite costly for a Chinese flagship. But this information is not official yet, so we better wait for some concrete details.

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We have been hearing for months that LeTV will release the first Snapdragon 820 powered smartphone. And these rumors were bang on target as Qualcomm and LeTV announced the first Snapdragon 820 powered smartphone in the world, the LeTV Le Max Pro earlier today. We already know a lot about the device, thanks to the previous leaks, but now, we have some official details to add to it.

One thing to note here is that, despite the announcement this early, neither LeTV nor Qualcomm has revealed when the phone is going to be released. The only thing we know right now is that the phone will be available for purchase sometime in the first half of 2016. That’s a pretty vague time frame, so we will have to wait for more availability details.

Even in the specs department, there are many details that are yet to be announced. But what we know is that the phone will also be the first commercial handset to feature Qualcomm’s Ultrasonic Fingerprint Sensor called as Sense ID. Once again, the feature was rumored to debut with the Le Max Pro, so no surprises here. Qualcomm explains that the new Sense ID is much more reliable and secure than existing capacitive based fingerprint sensors. The main highlight of Sense ID is the use of an ultrasonic scanner to create extremely detailed 3D fingerprint maps. Plus, it works even under plastic, metal and other materials. This is why the sensor on the Le Max Pro works although it’s located under 400 micrometers of metal.

Another highlighted feature of the Le Max Pro is the support for the latest Wi-Fi 802.11 ad standard which is much faster than previous generations, since it adds a new frequency band, 60GHz. The phone is also officially confirmed to feature fast 4G LTE and Qualcomm’s Quick Charge 2.0. From what we can see, the phone looks the same as its predecessor, the Le Max featuring an all metal body.

As for the other specs, we will probably get to know more at the CES event. According to rumors, the phone features a 6.3-inch 2K display with 4GB LPDDR4 RAM, 64GB storage, 21MP rear camera, and 3400mAh battery. AnTuTu performance is said to be impressive, scoring nearly 130K in the test.

Hopefully, we will get more information about the handset in the next couple of days. Stay tuned for more details.

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After releasing the LeTV 1S mid-range model a couple of months back, we have not yet heard about a new smartphone from the Chinese media giant. However, thanks to the numerous rumors and leaks that have surfaced in recently, we know that the company is preparing a new device for launch soon, namely the LeTV Le Max Pro. From the naming scheme and the leaked specs, this device seems to be the successor to the phablet Le Max that was released back in April this year.

Now, a new leak reveals the specifications of the Le Max Pro, and it looks like the phone will be much more powerful than its predecessor. Apart from the usual specs, which we have already seen, thanks to its AnTuTu benchmark listing, the phone is now rumored to feature Wi-Fi 802.11 ad technology, which is the latest standard in wireless connectivity. Many of the recent flagships boast of 802.11 ac Wi-Fi technology, but it looks like LeTV is going to set the bar next year with this new age tech. This standard adds a new 60GHz frequency band and supports speeds up to 7GBps.

Apart from the new Wi-Fi standard, the phone will reportedly come with Qualcomm’s Ultrasonic Fingerprint Sensor. This will make it one of the first phones with this new sensor. One of the highlights of this sensor is that it can be placed under a number of materials like glass, aluminum, stainless steel, sapphire or even plastic. It is said that things like sweat, dirt, grease etc don’t affect it, which means the efficiency will be quite good.

Apart from these new age features, the Le Max Pro will come with Snapdragon 820 quad-core chipset with 4GB of RAM under the hood. There will be 32/64/128GB of internal storage options. The display will be quite large, like its predecessor. So, you get a 6.33-inch WQHD 2560 x 1440 pixel screen up front. The rear camera is said to be of 21MP while, at the front, you can expect a 4MP Ultrapixel camera.

If true, the Le Max Pro would really set the bar for other flagships that will debut next year. It comes with the new Snapdragon 820 chip, Ultrasonic fingerprint ID and the fast Wi-Fi 802.11 ad standard (supports transfer speeds up to 7GBps) which are some of the features that could end up in a number of flagships in 2016.

We expect a LeTV to show off the Le Max Pro at CES 2016, but let’s wait for an official confirmation from the company.

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