TSMC 3nm process Archives - Gizmochina

Tesla to adopt TSMC’s 3nm chips in 2024, boosting its revenue prospects

Debasish — Tue, 26 Dec 2023 09:34:31 +0000

Tesla has confirmed its participation in TSMC’s (Taiwan Semiconductor Manufacturing Company) 3nm NTO chip design finals for the upcoming year. This surge in TSMC’s 3nm chip production, scheduled for 2024, reflects the growing demand for advanced semiconductor solutions. Notably, Tesla’s inclusion as an N3P customer signals its intent to leverage TSMC’s cutting-edge technology for the production of next-generation Full Self-Driving (FSD) smart driving chips.

About TSMC’s N3P process

TSMC‘s ambitious plan for the N3P process involves commencing production in 2024. Compared to the N3E process, N3P aims to deliver a 5% improvement in performance, a 5% to 10% reduction in power consumption, and a remarkable 1.04 times increase in chip density. TSMC has emphasized that N3P’s performance, power, and area (PPA) metrics, along with technology maturity, outpace Intel’s 18A process.

Tesla’s collaboration with TSMC is not new, with the electric vehicle manufacturer having placed multiple orders in the past. Previous ventures include the Dojo D1 chip utilizing the 7nm process and the HW 4.0 chip featuring the 5nm process. The addition of Tesla to the N3P customer list marks a strategic move for both companies.

Analysts foresee this partnership propelling Tesla to the status of TSMC’s seventh-largest customer, injecting fresh momentum into TSMC’s revenue growth trajectory. As Tesla continues to lead the automotive industry in innovative technologies, the collaboration with TSMC underscores the pivotal role semiconductor advancements play in shaping the future of electric and autonomous vehicles.

TSMC plans to launch a more advanced version of its 3nm process

Anurag — Thu, 20 Jul 2023 15:39:04 +0000

If previous reports are to be believed, TSMC is not getting satisfactory yield from its 3nm process node. The Taiwanese company is stuck at 55% while even Samsung has apparently managed to get a 60% yield. But it seems TSMC is planning rebound as an executive has now confirmed a more advanced 3nm process is in development. There have also been comments about the semiconductor industry’s fate in the coming future.

The new version will bring performance improvements

TSMC cut the ribbons off its 3nm process towards the end of last year. A lot of big names are looking forward to the development of this process node. Reports suggest Apple’s upcoming A17 and M2 chips will be based on the new processor. But it may not be very economical for TSMC due to poor yield.

However, the semiconductor company is working on a more powerful version of its 3nm process technology (Via ITHome). Luo Zhenqiu, general manager of TSMC (China) Co., Ltd., made the announcement at the 2023 World Semiconductor Conference in Nanjing. He said that TSMC has been preparing to launch the new process node since it began mass production of 3nm chips in the fourth quarter of last year. The new process node is expected to offer significant performance improvements over the current 3nm node.

The TSMC exec also notes that the global semiconductor industry is currently valued at between $500 billion and $600 billion. It is projected to reach $1 trillion by 2030. According to Lu Zhenqiu, the market distribution is expected to be as follows: high-computing power products will account for 40%, mobile computing (mobile phones) will comprise 30%, high-growth industries will represent 15%, and smart wearable devices will make up 10% of the market.

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Apple’s A17 chip will be fabbed on TSMC’s next-gen 3-nm node: Report

Anurag — Wed, 14 Sep 2022 14:29:22 +0000

Apple officially unveiled the iPhone 14 series at the “Far out” event held on September 7. And while people still wait to get their hands on the new iPhones, details about the upcoming iPhone 15 have already started to make headlines. A new report suggests the next generation A17 bionic, likely to be used in the iPhone 15 series, will be manufactured on TSMC’s 3-nm process node. In fact, Apple could be the first company to use this technology.

Nikkei Asia, citing sources, claims that Apple’s A17 Bionic chip that will be packed inside future iPhones will be made using Taiwan Semiconductor Manufacturing Co.’s latest 3nm process.

For the uninitiated, the “nm” (nanometer) parameter is the size of the transistors that make up a CPU and their distance from one another. The smaller the number (6nm, 4nm, or 3nm), the more transistors can fit on the chipset, making it more powerful, but also more difficult and costly to make.

The A17 processor will be available in the second half of 2023 and it will be used in the premium devices in the iPhone lineup slated for release in 2023, says the report. This means the non-pro models will likely be equipped with this year’s A16 chipset.

TSMC has claimed that the N3E (3nm process) will outperform the first iteration of the technology in terms of performance and energy efficiency. The process is also said to be more cost-effective than its predecessor.

As mentioned, the iPhone 14 series debuted recently. While all the models in the series come with new upgrades and features, it’s the iPhone 14 Pro and Pro Max that are stealing all the attention. They are equipped with the new A16 bionic chipset that offers some serious improvements in performance.