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Snapdragon 830 Specs Leaked: 10nm Process, Early Next Year Availability

by Jed John 0

Just as MediaTek is working on releasing the Helio X30 high-end chipset into the market, rival chipmaker Qualcomm is also working hard on its own Snapdragon 830 next-generation chipset to ensure it features in flagships next year. The Snapdragon 830 chipset had been embroiled in rumors surrounding its specs and more rumors continues to chip in.

Snapdragon 830

Lately, a Weibo user leaked what could be insider information that confirms that the Snapdragon 830 processor will use the 10nm process and that the next generation chipset from Qualcomm will be available next year. The SD830 chipset will likely be announced later this year but would hit the market next year, making its debut most likely on Samsung’s 2017  Galaxy S8 flagship according to other reports.

Earlier rumors had speculated that the Qualcomm Snapdragon 830 processor will use the 10nm FinFET process and Kyro 200 architecture, sporting an Adreno 540 GPU, X16 baseband which is allegedly capable of downlaod speed of up to 980Mbps and has LPDDR4X memory and 4K × 2K / 60fps video recording, dual lifting performance and functionality.

Read More: Snapdragon 830 Rumored To Use Samsung’s 10nm Process, Supports 8GB RAM

Since the Helio X30 chipset from MediaTek is also rumored to use the same 10nm process, it is unclear which among the two will display superior performance when launched. All the same, the Snapdragon 830 processor is believed to greatly reduce power consumption in smartphones and also provide heat control capabilities.

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