Qualcomm’s next flagship chipset is he Snapdragon 845. Details of the Mobile Platform expected to be unveiled in December have leaked online.
According to the source, even though major foundries have begun 7nm trials, the flagship chips for next year will be built using the 10nm process and that includes Qualcomm’s Snapdragon 845 mobile platform too. However, the SD845 will use LPE and not LPP like the Exynos 9810.
The Snapdragon 845 will remain an octa-core processor. Four of them will be the Cortex-A75 and the other four will be Cortex-A53 cores. The SD845’s GPU will be an Adreno 630.
The chipset will have support for up to 25MP dual front and dual rear cameras, have a X20 baseband, support for 802.11 ad Wi-Fi, and have a maximum download speed of 1.2Gbps.
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The Snapdragon 845 will likely appear first in the Samsung Galaxy S9 and S9+ globally and in the Xiaomi Mi 7 in China.
(Source)
