The past few days have been flooded with news about the upcoming Xiaomi Redmi Pro smartphone that will be announced on July 27. In the past three days, the company released a few teasers which hinted and almost confirmed that the phone will come with a metal body, deca-core processor, dual cameras and OLED display. However, now, Xiaomi’s CEO, Lei Jun has officially confirmed the processor on board the upcoming smartphone as well as the presence of dual cameras at the back.
First of all, Lei Jun confirmed that the Redmi Pro will feature the Helio X25 deca-core processor. We had a doubt whether the phone would be using the slightly slower Helio X20, but this confirms that the faster variant is going to end up on the device. Along with the image (above), he asked his fans which other flagships use Helio X25 chipset inside. Well, there are the two popular ones, the flagship Pro 6 and then, the Le 2 Pro. So, looks like he’s trying to say that the new Redmi model will be competing with these two devices.
About an hour later, Lei Jun further took to Weibo to ask another question to his fans: “Some smartphones use two cameras to take pictures, what would you call this technology?”. He even gave three options: Dual cameras, Dual lens and double cameras.
Well, we take this as a confirmation that the upcoming Redmi Pro features a dual camera setup!
Now, we look forward to more details about the rest of the specs of the device, such as the display size, RAM, storage, fingerprint and other features. Expect most of these details to be revealed in the coming days to the launch. Meanwhile, you can read this article for its earlier leaked specs.