Xiaomi is expected to launch its flagship smartphone of the year — Xiaomi Mi 7 at the upcoming Mobile World Congress (MWC) in Barcelona, Spain. Recently, it was revealed that the China-based smartphone manufacturer is one of the exhibitors at the event.
While we’ve seen a couple of concept-based renders of the phone in the past, today an alleged render of Mi 7 has surfaced online through a Nigerian website. The leaked image reveals the rear side of the upcoming device.
The leaked image suggests that the device could come with a glass back panel. This hints at the possibility of wireless charging support for the Xiaomi Mi 7. There are also two camera sensors placed side-by-side along with a dual-tone LED flash. Below the camera module, there’s a fingerprint sensor at the top-centre position.
As the fingerprint sensor is placed on the back panel, we are expecting the phone to come with a full-screen display with 18:9 aspect ratio. Based on the previous leaks and reports, the phone could feature a 6.01-inch bezel-less display.
While nothing is confirmed yet in terms of phone’s specifications, the Mi 7 is likely to be powered by recently announced Snapdragon 845 chipset. Last month, during the announcement of Qualcomm’s Snapdragon 845 processor, Xiaomi CEO Lei Jun said that the company’s upcoming flagship will be powered by the same chipset.
Xiaomi’s Lei Jun recently confirmed the company’s focus towards Artificial Intelligence (AI) in 2018. So, there’s a possibility that the upcoming phones from Xiaomi will be equipped with AI-based features. In line with that, Mi 7’s camera is expected to come optimized with AI to deliver stellar photography experience.
Along with Mi 7, the company is also expected to launch Mi 7 Plus at the Mobile World Congress. However, the company has not yet officially confirmed this. So, we’ll just have to wait a little longer to confirm this development.